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1. WO2020192930 - THERMAL MANAGEMENT SYSTEM, METHOD, AND DEVICE FOR MONITORING HEALTH OF ELECTRONIC DEVICES

Note: Text based on automatic Optical Character Recognition processes. Please use the PDF version for legal matters

[ EN ]

Patent claims:

1. A thermal management device (102) comprising:

- a non-transitory computer readable storage medium (302)

configured to store one or more modules comprising computer program instructions;

- at least one processor (301) communicatively coupled to the non-transitory computer readable storage medium (302), the at least one processor (301) configured to execute the computer program instructions; and

- the modules of the thermal management device (102)

comprising :

o a thermal data management module (102A) configured to obtain thermal data associated with an electronic device (101A-101N) communicatively couplable with the thermal management device (102), wherein the electronic device (101A-101N) comprises at least one thermal sensing unit (IOΐAc-IOΐNi) , and wherein the thermal sensing unit (10ΐAc-10ΐNc) is adaptable to sense the thermal data associated with the electronic device (101A-101N) ;

o a thermal profile generation module (102B) configured to generate a thermal profile (203) based on the thermal data; and

o a thermal data analysis module (102C) configured to determine an abnormal thermal condition (203B) associated with the electronic device (101A-101N) based on the thermal profile (203) .

2. The thermal management device (102) according to the claim 1, wherein the thermal data management module (102A) is configured to activate the thermal sensing unit (10ΐAc-10ΐNc) in the

electronic device (101A-101N) for selectively obtaining the thermal data.

3. The thermal management device (102) according to the claim 1, wherein the thermal profile (203) comprises at least one of a temporal profile and a spatial profile of the thermal data associated with the electronic device (101A-101N) .

4. The thermal management device (102) according to any one of the claims 1 and 3, wherein the thermal profile (203) comprises an aggregated profile of the thermal data associated with an integrated circuitry (201A, 201B, or 201C) of one or more electronic devices (101A-101N) .

5. The thermal management device (102) according to the claim 1, wherein the thermal data analysis module (102C) is configured to :

- obtain a reference thermal profile associated with one or more electronic devices (101A-101N) ;

- compare the thermal profile (203) and the reference thermal profile; and

- determine the abnormal thermal condition (203B) based on the comparison of the thermal profile (203) and the reference thermal profile using a pre-defined deviation threshold of each of the electronic devices (101A-101N) .

6. The thermal management device (102) according to any one of the claims 1 and 5, wherein the thermal data analysis module (102C) is configured to:

- analyse the abnormal thermal condition (203B) based on one or more performance parameters, wherein the performance parameters comprise a pre-defined deviation threshold of each of the electronic devices (101A-101N) , a rate of occurrence of a deviation in the thermal profile (203), and one or more properties of an integrated circuitry (201A, 201B, or 201C) of each of the electronic devices (101A- 101N) with which the abnormal thermal condition (203B) is associated; and

- determine a risk index based on the analysis of the

abnormal thermal condition (203B) .

7. The thermal management device (102) according to any one of the claims 1, 5, and 6, further comprising a thermal

conditioning module (102D) configured to:

- determine a preventive action to be performed on at least one electronic device (101A-101N), such that the abnormal thermal condition (203B) is addressed; and

- initiate the preventive action at the at least one

electronic device (101A-101N) .

8. An electronic device (101A-101N) comprising:

- an integrated circuitry (201A, 201B, 201C) ; and

- a thermal sensing unit (10ΐAc-10ΐNc) adaptable to sense

thermal data associated with the electronic device (101A- 101N) , wherein the thermal sensing unit (10ΐAc-10ΐNc) comprises a plurality of thermal sensors (202A, 202B, 202C, 202D) operably connected with the integrated circuitry (201A, 20 IB, 201C) .

9. The electronic device (101A-101N) according to the claim 8, wherein each of the thermal sensors (202A, 202B, 202C, 202D) selectively senses the thermal data associated with the

integrated circuitry (201A, 201B, 201C) of the electronic device (101A-101N) , via the thermal management device (102) .

10. A thermal management system (100), comprising:

- one or more electronic devices (101A-101N) according to the claims 8-9; and

- a thermal management device (102) according to the claims 1-7, communicatively couplable with the one or more electronic devices (101A-101N) .

11. A method (400) for managing thermal data associated with one or more electronic devices (101A-101N) , the method employing a thermal management device (102) communicatively couplable with the one or more electronic devices (101A-101N) , the method (400) comprising :

- obtaining (401) thermal data associated with an electronic device (101A-101N) ;

- generating a thermal profile (203) based on the thermal data; and

- determining an abnormal thermal condition (203B) associated with the electronic device (101A-101N) based on the thermal profile (203) .

12. The method (400) according to the claim 11, wherein obtaining (401) thermal data comprises selectively activating a thermal sensing unit (10ΐAc-10ΐNc) in the electronic device (101A-101N) for sensing the thermal data.

13. The method (400) according to the claim 11, wherein determining the abnormal thermal condition (203B) comprises: - obtaining a reference thermal profile associated with one or more electronic devices (101A-101N);

- comparing the thermal profile (203) and the reference

thermal profile; and

- determining the abnormal thermal condition (203B) based on the comparison of the thermal profile (203) and the reference thermal profile using a pre-defined deviation threshold of each of the electronic devices (101A-101N) .

14. The method (400) according to any one of the claims 11 and 13, further comprising:

- analysing the abnormal thermal condition (203B) based on one or more performance parameters, wherein the performance parameters comprise a pre-defined deviation threshold of each of the electronic devices (101A-101N) , a rate of occurrence of a deviation in the thermal profile (203), and one or more properties of an integrated circuitry (201A, 201B, or 201C) of each of the electronic devices (101A- 101N) with which the abnormal thermal condition (203B) is associated; and

- determining a risk index based on the analysis of the

abnormal thermal condition (203B) .

15. The method (400) according to any one of the claims 11, 13, and 14, further comprising:

- determining a preventive action to be performed on at least one electronic device (101A-101N), such that the abnormal thermal condition (203B) is addressed; and

- initiating the preventive action at the at least one

electronic device (101A-101N) .