Processing

Please wait...

Settings

Settings

Goto Application

1. WO2020192638 - ELECTRONIC PANEL PACKAGING METHOD AND MANUFACTURING METHOD AND ELECTRONIC PANEL

Publication Number WO/2020/192638
Publication Date 01.10.2020
International Application No. PCT/CN2020/080761
International Filing Date 24.03.2020
IPC
H01L 51/52 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52Details of devices
H01L 51/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants
  • 京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN]/[CN]
  • 北京京东方显示技术有限公司 BEIJING BOE DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 孙玉家 SUN, Yujia
  • 刘晓那 LIU, Xiaona
  • 袁帅 YUAN, Shuai
  • 王孟杰 WANG, Mengjie
  • 吴臣臣 WU, Chenchen
  • 郑子易 ZHENG, Ziyi
  • 张瑞 ZHANG, Rui
  • 陈玉琼 CHEN, Yuqiong
Agents
  • 北京市柳沈律师事务所 LIU, SHEN & ASSOCIATES
Priority Data
201910227514.325.03.2019CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) ELECTRONIC PANEL PACKAGING METHOD AND MANUFACTURING METHOD AND ELECTRONIC PANEL
(FR) PROCÉDÉ D'ENCAPSULATION DE PANNEAU ÉLECTRONIQUE ET PROCÉDÉ DE FABRICATION DE PANNEAU ÉLECTRONIQUE
(ZH) 电子面板的封装方法及制作方法和电子面板
Abstract
(EN)
An electronic panel packaging method and manufacturing method and an electronic panel. The electronic panel packaging method comprises: manufacturing at least one inorganic film layer (10) and at least one organic film layer (20) stacked in alternate layers on the surface of a substrate (90) used for forming the electronic panel; at least when manufacturing one organic film layer (20), performing hydrophobic treatment on an initial film layer (20A) used for forming said organic film layer (20), such that the hydrophilic end groups of the initial film layer (20A) are treated into hydrophobic end groups, thereby improving the sealing properties of the electronic panel.
(FR)
L'invention concerne un procédé d'encapsulation et un procédé de fabrication de panneau électronique et un panneau électronique. Le procédé d'encapsulation de panneau électronique comprend : la fabrication d'au moins une couche de film inorganique (10) et d'au moins une couche de film organique (20) empilées dans des couches alternées à la surface d'un substrat (90) utilisé pour former le panneau électronique ; au moins lors de la fabrication d'une couche de film organique (20), la réalisation d'un traitement hydrophobe sur une couche de film initiale (20A) utilisée pour former ladite couche de film organique (20), de telle sorte que les groupes terminaux hydrophiles de la couche de film initiale (20A) sont traités pour donner des groupes terminaux hydrophobes, améliorant ainsi les propriétés d'étanchéité du panneau électronique.
(ZH)
一种电子面板的封装方法及制作方法和电子面板。电子面板的封装方法包括在用于形成电子面板的基板(90)表面制作交替层叠的至少一层无机膜层(10)和至少一层有机膜层(20);至少在制作一层有机膜层(20)时,对用于形成该一层有机膜层(20)的初始膜层(20A)进行疏水性处理,以使初始膜层(20A)的亲水性端基被处理成疏水性端基,以提高电子面板的密封性能。
Also published as
Latest bibliographic data on file with the International Bureau