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1. WO2020192286 - SUBSTRATE AND PREPARATION METHOD THEREFOR, AND ARRAY SUBSTRATE AND DISPLAY DEVICE

Publication Number WO/2020/192286
Publication Date 01.10.2020
International Application No. PCT/CN2020/074976
International Filing Date 13.02.2020
IPC
H01L 27/04 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
04the substrate being a semiconductor body
Applicants
  • 京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN]/[CN]
Inventors
  • 张锋 ZHANG, Feng
  • 吕志军 LV, Zhijun
  • 刘文渠 LIU, Wenqu
  • 董立文 DONG, Liwen
  • 宋晓欣 SONG, Xiaoxin
  • 崔钊 CUI, Zhao
  • 孟德天 MENG, Detian
  • 王利波 WANG, Libo
Agents
  • 北京银龙知识产权代理有限公司 DRAGON INTELLECTUAL PROPERTY LAW FIRM
Priority Data
201910238145.827.03.2019CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) SUBSTRATE AND PREPARATION METHOD THEREFOR, AND ARRAY SUBSTRATE AND DISPLAY DEVICE
(FR) SUBSTRAT ET SON PROCÉDÉ DE PRÉPARATION, ET SUBSTRAT MATRICIEL ET DISPOSITIF D'AFFICHAGE
(ZH) 衬底基板及其制备方法、阵列基板以及显示装置
Abstract
(EN)
Disclosed are a substrate and a preparation method therefor, and an array substrate and a display device. The substrate comprises a through hole (11); a first insulating layer (12), a conductive metal layer (13), and a second insulating layer (14) are stacked in the through hole (11) in a direction that a first surface (S1) of the substrate points to a second surface (S2); the conductive metal layer (13) extends to the first surface (S1) of the substrate along a side wall of the through hole (11); the second insulating layer (14) is provided with a via hole (141) extending to the conductive metal layer (13); and the first surface (S1) and the second surface (S2) are opposite to each other.
(FR)
L'invention concerne un substrat et son procédé de préparation, et un substrat matriciel et un dispositif d’affichage. Le substrat comprend un trou traversant (11) ; une première couche isolante (12), une couche métallique conductrice (13) et une seconde couche isolante (14) sont empilées dans le trou traversant (11) dans une direction telle qu'une première surface (S1) du substrat pointe vers une seconde surface (S2) ; la couche métallique conductrice (13) s'étend jusqu'à la première surface (S1) du substrat le long d'une paroi latérale du trou traversant (11) ; la seconde couche isolante (14) comporte un trou d'interconnexion (141) s'étendant jusqu'à la couche métallique conductrice (13) ; et la première surface (S1) et la seconde surface (S2) sont opposées l'une à l'autre.
(ZH)
公开了一种衬底基板及其制备方法、阵列基板及显示装置。该衬底基板包括通孔(11),通孔(11)内沿衬底基板第一表面(S1)指向第二表面(S2)的方向上,层叠设置有第一绝缘层(12)、导电金属层(13)和第二绝缘层(14);导电金属层(13)沿通孔(11)侧壁延伸至衬底基板第一表面(S1);第二绝缘层(14)设置有延伸至导电金属层(13)的过孔(141);第一表面(S1)与第二表面(S2)相背。
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