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1. WO2020191907 - THIN FILM ENCAPSULATION STRUCTURE, AND OLED DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR

Publication Number WO/2020/191907
Publication Date 01.10.2020
International Application No. PCT/CN2019/087554
International Filing Date 20.05.2019
IPC
H01L 51/52 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52Details of devices
H01L 51/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
CPC
H01L 51/5246
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5237Passivation; Containers; Encapsulation, e.g. against humidity
524Sealing arrangements having a self-supporting structure, e.g. containers
5246characterised by the peripheral sealing arrangements, e.g. adhesives, sealants
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants
  • 武汉华星光电半导体显示技术有限公司 WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 孙佳佳 SUN, Jiajia
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT & TRADEMARK AGENCY
Priority Data
201910232697.826.03.2019CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) THIN FILM ENCAPSULATION STRUCTURE, AND OLED DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR
(FR) STRUCTURE D'ENCAPSULATION EN COUCHES MINCES, ET PANNEAU D'AFFICHAGE À DELO ET SON PROCÉDÉ DE FABRICATION
(ZH) 薄膜封装结构、OLED显示面板及其制作方法
Abstract
(EN)
A thin film encapsulation structure, and an OLED display panel and a manufacturing method therefor. The thin film encapsulation structure comprises: a first inorganic thin film (12); a first organic thin film (14) located on the first inorganic thin film (12); and a second inorganic thin film (16) covering the first organic thin film (14) and the first inorganic thin film (12), wherein the material forming the first organic thin film (14) is an organic polymer having self-repairing capability.
(FR)
L'invention concerne une structure d'encapsulation en couches minces, ainsi qu'un panneau d'affichage à DELO et son procédé de fabrication. La structure d'encapsulation en couches minces comprend : une première couche mince inorganique (12) ; une première couche mince organique (14) située sur la première couche mince inorganique (12) ; et une seconde couche mince inorganique (16) recouvrant la première couche mince organique (14) et la première couche mince inorganique (12), le matériau formant la première couche mince organique (14) étant un polymère organique doué d'une capacité d'auto-réparation.
(ZH)
一种薄膜封装结构、OLED显示面板及其制作方法。所述薄膜封装结构包括:第一无机薄膜(12);第一有机薄膜(14),所述第一有机薄膜(14)位于所述第一无机薄膜(12)上;第二无机薄膜(16),所述第二无机薄膜(16)覆盖所述第一有机薄膜(14)和所述第一无机薄膜(12);其中,构成所述第一有机薄膜(14)的材料为具有自修复能力的有机聚合物。
Also published as
Latest bibliographic data on file with the International Bureau