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1. WO2020191546 - FLEXIBLE LED SURFACE LIGHT SOURCE AND MANUFACTURING METHOD THEREFOR, AND LIGHT EMITTING DEVICE

Publication Number WO/2020/191546
Publication Date 01.10.2020
International Application No. PCT/CN2019/079337
International Filing Date 22.03.2019
IPC
H01L 33/00 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H01L 33/52 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
F21V 23/00 2015.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
23Arrangement of electric circuit elements in or on lighting devices
F21Y 105/00 2016.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V124
105Planar light sources
F21Y 115/10 2016.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V124
115Light-generating elements of semiconductor light sources
10Light-emitting diodes
CPC
H01L 25/0753
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
0753the devices being arranged next to each other
H01L 2933/0033
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2933Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
0008Processes
0033relating to semiconductor body packages
H01L 2933/005
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2933Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
0008Processes
005relating to encapsulations
H01L 2933/0066
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2933Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
0008Processes
0066relating to arrangements for conducting electric current to or from the semiconductor body
H01L 33/486
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
483Containers
486adapted for surface mounting
H01L 33/54
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
54having a particular shape
Applicants
  • 厦门三安光电有限公司 XIAMEN SAN'AN OPTOELECTRONICS CO., LTD. [CN]/[CN]
Inventors
  • 包书林 BAO, Shulin
Priority Data
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) FLEXIBLE LED SURFACE LIGHT SOURCE AND MANUFACTURING METHOD THEREFOR, AND LIGHT EMITTING DEVICE
(FR) SOURCE LUMINEUSE DE SURFACE DEL FLEXIBLE ET PROCÉDÉ DE FABRICATION ASSOCIÉ, ET DISPOSITIF ÉLECTROLUMINESCENT
(ZH) 柔性LED面光源、制作方法及发光设备
Abstract
(EN)
Disclosed are a press-formed flexible LED surface light source and manufacturing method therefor. The LED surface light source is formed by attaching LED chips to a flexible circuit board and directly carrying out pressing and packaging. The LED surface light source emits uniform light, can be folded in any manner, features a small thickness, and can be widely applied to fields such as physiotherapy healthcare and display. The flexible LED surface light source comprises: a flexible circuit board having an upper surface provided with a conductive circuit, a plurality of LED solder points being provided on the conductive circuit; a flip LED chip array which is mounted on the flexible circuit board by means of the plurality of LED solder points and implements electrical connection by means of the conductive circuit; and a packaging layer which is press-formed by a liquid adhesive by means of a mold and covers the front surface of the conductive circuit and the LED chips.
(FR)
L'invention concerne une source de lumière de surface DEL flexible formée à la presse et son procédé de fabrication. La source de lumière de surface DEL est formée en attachant des puces de DEL à une carte de circuit imprimé flexible et en réalisant directement un pressage et une encapsulation. La source de lumière de surface DEL émet une lumière uniforme, peut être pliée de n'importe quelle manière, présente une faible épaisseur, et peut être largement appliquée à des domaines tels que les soins de santé de physiothérapie et les affichages. La source de lumière de surface DEL flexible comprend : une carte de circuit imprimé flexible ayant une surface supérieure pourvue d'un circuit conducteur, une pluralité de points de soudure de DEL étant disposés sur le circuit conducteur ; un réseau de puces de DEL retournées qui est monté sur la carte de circuit imprimé flexible au moyen de la pluralité de points de soudure de DEL et met en œuvre une connexion électrique au moyen du circuit conducteur ; et une couche d'encapsulation qui est formée par pression par un adhésif liquide au moyen d'un moule et recouvre la surface avant du circuit conducteur et les puces de DEL.
(ZH)
本发明公开了一种压合成型的柔性LED面光源及其制作方法,将LED芯片贴合在柔性电路板上,直接压合封装而成,出光均匀且可任意折叠,厚度薄,可广泛运用于理疗保健、显示等领域。该柔性LED面光源,包括:柔性电路板,其上表面上设置有导电线路,所述导电线路上设置有多个LED焊接点;倒装LED芯片阵列,通过所述多个LED焊接点安装于所述柔性电路板上,通过所述导电线路实现电性连接;封装层,采用液态胶材通过模具压合成型,覆盖所述导电线路正面及所述LED芯片。
Also published as
CN201980003937.5
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