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1. WO2020183649 - PROCESSING SYSTEM AND PROCESSING METHOD

Publication Number WO/2020/183649
Publication Date 17.09.2020
International Application No. PCT/JP2019/010259
International Filing Date 13.03.2019
IPC
B23K 26/70 2014.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
70Auxiliary operations or equipment
CPC
B23K 26/70
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
70Auxiliary operations or equipment
Applicants
  • 株式会社ニコン NIKON CORPORATION [JP]/[JP]
Inventors
  • 川井 秀実 KAWAI, Hidemi
Agents
  • 江上 達夫 EGAMI, Tatsuo
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PROCESSING SYSTEM AND PROCESSING METHOD
(FR) SYSTÈME DE TRAITEMENT ET PROCÉDÉ DE TRAITEMENT
(JA) 加工システム及び加工方法
Abstract
(EN)
This processing system is provided with a housing (6) which internally accommodates an object (W) and which has formed therein a part (62) through which light can pass, a radiating device (211) which radiates a processing beam (PL) for processing the object, a first member (651) onto which an energy beam (EL) from the radiating device, directed toward the outside of the housing through said part, is incident, and a second member (652) onto which the energy beam that has passed through the first member is incident, wherein the first member reduces the intensity of the energy beam incident on the first member, and the second member reduces the intensity of the energy beam from the first member, incident on the second member.
(FR)
L'invention concerne un système de traitement pourvu d'un boîtier (6) qui loge intérieurement un objet (W) et dans lequel est formée une partie (62) à travers laquelle de la lumière peut passer, un dispositif rayonnant (211) qui rayonne un faisceau de traitement (PL) pour traiter l'objet, un premier élément (651) sur lequel un faisceau d'énergie (EL) provenant du dispositif rayonnant, dirigé vers l'extérieur du boîtier à travers ladite partie, est incident et un deuxième élément (652) sur lequel le faisceau d'énergie qui a traversé le premier élément est incident, le premier élément réduisant l'intensité du faisceau d'énergie incident sur le premier élément et le deuxième élément réduisant l'intensité du faisceau d'énergie provenant du premier élément, incident sur le deuxième élément.
(JA)
加工システムは、内部に物体(W)を収容し、光が通過可能である部分(62)が形成されたハウジング(6)と、物体を加工する加工ビーム(PL)を照射する照射装置(211)と、前記部分を介してハウジングの外部へ向かう照射装置からのエネルギビーム(EL)が入射する第1部材(651)と、第1部材を介したエネルギビームが入射する第2部材(652)とを備え、第1部材は、第1部材に入射したエネルギビームの強度を低減し、第2部材は、第1部材から第2部材に入射したエネルギビームの強度を低減する。
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