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1. WO2020182628 - COMPONENT FOR A STRETCHABLE ELECTRONIC DEVICE

Publication Number WO/2020/182628
Publication Date 17.09.2020
International Application No. PCT/EP2020/055924
International Filing Date 05.03.2020
IPC
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 3/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
CPC
H05K 1/0283
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0277Bendability or stretchability details
0283Stretchable printed circuits
H05K 2201/0133
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0104Properties and characteristics in general
0133Elastomeric or compliant polymer
H05K 2201/0162
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
01Dielectrics
0137Materials
0162Silicon containing polymer, e.g. silicone
H05K 2201/0272
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
02Fillers; Particles; Fibers; Reinforcement materials
0203Fillers and particles
0263Details about a collection of particles
0272Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
H05K 2201/0323
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
03Conductive materials
032Materials
0323Carbon
H05K 2203/095
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
09Treatments involving charged particles
095Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
Applicants
  • IMPERIAL COLLEGE INNOVATIONS LIMITED [GB]/[GB]
Inventors
  • GRELL, Maximilian
  • BARANDUN, Giandrin
  • GUDER, Firat
  • KASIMATIS, Michael
  • COTUR, Yasin
Agents
  • LLOYD, Robin, Jonathan
Priority Data
1907270.123.05.2019GB
2019010012014.03.2019GR
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) COMPONENT FOR A STRETCHABLE ELECTRONIC DEVICE
(FR) COMPOSANT POUR DISPOSITIF ÉLECTRONIQUE ÉTIRABLE
Abstract
(EN)
A method of manufacturing a component for a stretchable electronic device comprises providing a silicon wafer comprising a first surface and a second surface; applying a layer of a conductive metal onto at least a portion of the first surface of the silicon wafer; providing a stretchable silicone substrate having a first surface and a second surface; and plasma bonding at least a portion of the second surface of the silicon wafer to at least a portion of the first surface of the stretchable silicone substrate.
(FR)
Procédé de fabrication d'un composant pour un dispositif électronique étirable comprenant la fourniture d'une tranche de silicium qui comprend une première surface et une seconde surface; l'application d'une couche d'un métal conducteur sur au moins une partie de la première surface de la tranche de silicium; la fourniture d'un substrat de silicone étirable ayant une première surface et une seconde surface; et la liaison au plasma d'au moins une partie de la seconde surface de la tranche de silicium à au moins une partie de la première surface du substrat de silicone étirable.
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