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1. WO2020142225 - APPARATUS, SYSTEM, AND METHOD OF PROVIDING A CIRCUIT BOARD CARRIER FOR AN UNDERFILL SYSTEM

Publication Number WO/2020/142225
Publication Date 09.07.2020
International Application No. PCT/US2019/067307
International Filing Date 19.12.2019
IPC
H05K 13/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
H05K 13/04 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components
CPC
H05K 13/0069
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
0069Holders for printed circuit boards
H05K 13/0469
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
13Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
04Mounting of components ; , e.g. of leadless components
046Surface mounting
0469by applying a glue or viscous material
Applicants
  • JABIL INC. [US]/[US]
Inventors
  • TUDMAN, Mark
  • LOFTIN, Rayce
Agents
  • MCWILLIAMS, Thomas, J.
Priority Data
62/788,51904.01.2019US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) APPARATUS, SYSTEM, AND METHOD OF PROVIDING A CIRCUIT BOARD CARRIER FOR AN UNDERFILL SYSTEM
(FR) APPAREIL, SYSTÈME, ET PROCÉDÉ DE FOURNITURE D’UN SUPPORT DE CARTE DE CIRCUIT IMPRIMÉ POUR SYSTÈME DE REMPLISSAGE SOUS-JACENT
Abstract
(EN)
An apparatus, system and method for a carrier suitable to carry a circuit board through a semiconductor underfill process. The apparatus, system and method includes a modular carrier capable of supporting a printed circuit board during at least an underfill process, the modular carrier comprising: an outer frame having, at least about a center point thereof, at least one open aspect; and at least one frame inset suitable to be removably placed within the at least one open aspect, and capable of supporting at least a first type of the printed circuit board.
(FR)
L'invention concerne un appareil, un système et un procédé pour un support approprié pour porter une carte de circuit imprimé par l'intermédiaire d'un processus de remplissage sous-jacent à semi-conducteur. L'appareil, le système et le procédé comprennent un support modulaire capable de supporter une carte de circuit imprimé pendant au moins un processus de remplissage sous-jacent, le support modulaire comprenant : un cadre externe ayant, au moins autour d'un point central de celui-ci, au moins un aspect ouvert ; et au moins un insert de cadre approprié pour être placé de manière amovible dans l'ou les aspects ouverts, et capable de supporter au moins un premier type de la carte de circuit imprimé.
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