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1. WO2020142199 - PACKAGED ELECTRONIC DEVICE WITH SUSPENDED MAGNETIC SUBASSEMBLY

Publication Number WO/2020/142199
Publication Date 09.07.2020
International Application No. PCT/US2019/066729
International Filing Date 17.12.2019
IPC
H01L 23/48 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H01L 23/495 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
495Lead-frames
H01L 21/50 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
CPC
H01L 2224/05554
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
05of an individual bonding area
0554External layer
0555Shape
05552in top view
05554being square
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48175
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48153the body and the item being arranged next to each other, e.g. on a common substrate
48175the item being metallic
H01L 2224/48195
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48153the body and the item being arranged next to each other, e.g. on a common substrate
48195the item being a discrete passive component
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
H01L 2224/73265
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73251on different surfaces
73265Layer and wire connectors
Applicants
  • TEXAS INSTRUMENTS INCORPORATED [US]/[US]
  • TEXAS INSTRUMENTS JAPAN LIMITED [JP]/[JP] (JP)
Inventors
  • KHANOLKAR, Vijaylaxmi
  • MULLENIX, Joyce
Agents
  • ABRAHAM, Ebby
  • NEERINGS, Ronald
Priority Data
16/236,73031.12.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PACKAGED ELECTRONIC DEVICE WITH SUSPENDED MAGNETIC SUBASSEMBLY
(FR) DISPOSITIF ÉLECTRONIQUE CONDITIONNÉ AVEC SOUS-ENSEMBLE MAGNÉTIQUE SUSPENDU
Abstract
(EN)
A packaged electronic device (100) includes a die pad (104) directly connected to a first set (125) of conductive leads (124-139) of a leadframe structure, a semiconductor die (102) attached to the conductive die pad (104), a conductive support structure (121, 122) directly connected to a second set (127-131, 132-136) of conductive leads (124-139), and spaced apart from all other conductive structures of the leadframe structure (104, 108, 121, 122, 124-139). A magnetic assembly (110) is attached to the conductive support structure (121, 122), and a molded package structure (120) that encloses the conductive die pad (104, 108), the conductive support structure (121, 122), the semiconductor die (102, 106), the magnetic assembly (110) and portions of the conductive leads (124-139), the molded package structure (120) including a top side, and an opposite bottom side, wherein the lamination structure (112) is centered between the top and bottom sides.
(FR)
Dispositif électronique conditionné (100) comprenant une pastille de puce (104) connectée directement à un premier ensemble (125) de fils conducteurs (124-139) d'une structure de grille de connexion, une puce semi-conductrice (102) fixée à la pastille de puce conductrice (104), une structure de support conductrice (121, 122) connectée directement à un second ensemble (127-131, 132-136) de fils conducteurs (124-139), et espacée de toutes les autres structures conductrices de la structure de grille de connexion (104, 108, 121, 122, 124-139). Un ensemble magnétique (110) est fixé à la structure de support conductrice (121, 122), et une structure de boîtier moulé (120) qui renferme la pastille de puce conductrice (104, 108), la structure de support conductrice (121, 122), la puce semi-conductrice (102, 106), l'ensemble magnétique (110) et des parties des fils conducteurs (124-139), la structure de boîtier moulé (120) comprenant un côté supérieur et un côté inférieur opposé, la structure de stratification (112) étant centrée entre les côtés supérieur et inférieur.
Also published as
Latest bibliographic data on file with the International Bureau