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1. WO2020142152 - DEVICE COMPRISING FIRST SOLDER INTERCONNECTS ALIGNED IN A FIRST DIRECTION AND SECOND SOLDER INTERCONNECTS ALIGNED IN A SECOND DIRECTION

Publication Number WO/2020/142152
Publication Date 09.07.2020
International Application No. PCT/US2019/064011
International Filing Date 02.12.2019
IPC
H01L 23/498 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
498Leads on insulating substrates
H01L 23/50 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
50for integrated circuit devices
CPC
H01L 21/4853
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
4814Conductive parts
4846Leads on or in insulating or insulated substrates, e.g. metallisation
4853Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
H01L 2224/14131
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
12Structure, shape, material or disposition of the bump connectors prior to the connecting process
14of a plurality of bump connectors
141Disposition
1412Layout
1413Square or rectangular array
14131being uniform, i.e. having a uniform pitch across the array
H01L 2224/16235
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
16235the bump connector connecting to a via metallisation of the item
H01L 2224/17106
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
17of a plurality of bump connectors
171Disposition
17104relative to the bonding areas, e.g. bond pads
17106the bump connectors being bonded to at least one common bonding area
H01L 2224/81192
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
81using a bump connector
8119Arrangement of the bump connectors prior to mounting
81192wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
H01L 2224/81801
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
81using a bump connector
818Bonding techniques
81801Soldering or alloying
Applicants
  • QUALCOMM INCORPORATED [US]/[US]
Inventors
  • LANGARI, Abdolreza
  • LI, Yuan
  • GANGULY, Shrestha
  • CHEUNG, Terence
  • HUANG, Ching-Liou
  • WANG, Hui
Agents
  • THAVONEKHAM, S. Sean
Priority Data
16/453,80326.06.2019US
62/787,58002.01.2019US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) DEVICE COMPRISING FIRST SOLDER INTERCONNECTS ALIGNED IN A FIRST DIRECTION AND SECOND SOLDER INTERCONNECTS ALIGNED IN A SECOND DIRECTION
(FR) DISPOSITIF COMPRENANT DES PREMIÈRES INTERCONNEXIONS DE BRASURE ALIGNÉES DANS UNE PREMIÈRE DIRECTION ET DES SECONDES INTERCONNEXIONS DE BRASURE ALIGNÉES DANS UNE SECONDE DIRECTION
Abstract
(EN)
A device that includes a first die and a package substrate. The package substrate includes a dielectric layer, a plurality of vias formed in the dielectric layer, a first plurality of interconnects formed on a first metal layer of the package substrate, and a second plurality of interconnects formed on a second metal layer of the package substrate. The device includes a first series of first solder interconnects arranged in a first direction, the first series of first solder interconnects configured to provide a first electrical connection; a second series of first solder interconnects arranged in the first direction, the second series of first solder interconnects configured to provide a second electrical connection; a first series of second solder interconnects arranged in a second direction, the first series of second solder interconnects configured to provide the first electrical connection.
(FR)
Dispositif qui comprend une première puce et un substrat de boîtier. Le substrat de boîtier comprend une couche diélectrique, une pluralité de trous d'interconnexion formés dans la couche diélectrique, une première pluralité d'interconnexions formées sur une première couche métallique du substrat de boîtier, et une seconde pluralité d'interconnexions formées sur une seconde couche métallique du substrat de boîtier. Le dispositif comprend une première série d'interconnexions de brasure agencées dans une première direction, la première série de premières interconnexions de brasure étant conçue pour fournir une première connexion électrique; une seconde série d'interconnexions de brasure agencées dans la première direction, la seconde série de premières interconnexions de brasure étant conçue pour fournir une seconde connexion électrique; une première série de secondes interconnexions de brasure agencées dans une seconde direction, la première série de secondes interconnexions de brasure étant conçue pour fournir la première connexion électrique.
Also published as
Latest bibliographic data on file with the International Bureau