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1. WO2020141854 - POSITIVE PHOTOSENSITIVE RESIN COMPOSITION

Publication Number WO/2020/141854
Publication Date 09.07.2020
International Application No. PCT/KR2019/018795
International Filing Date 31.12.2019
IPC
G03F 7/039 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
039Macromolecular compounds which are photodegradable, e.g. positive electron resists
G03F 7/037 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032with binders
037the binders being polyamides or polyimides
G03F 7/025 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
025Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds
H01L 27/32 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
CPC
G03F 7/025
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
025Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds
G03F 7/037
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
032with binders
037the binders being polyamides or polyimides
G03F 7/039
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
039Macromolecular compounds which are photodegradable, e.g. positive electron resists
H01L 27/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
Applicants
  • 주식회사 동진쎄미켐 DONGJIN SEMICHEM CO., LTD. [KR]/[KR]
Inventors
  • 김동명 KIM, Dong Myung
  • 윤혁민 YOUN, Hyoc Min
  • 여태훈 YEO, Tai Hoon
  • 신경순 SHIN, Kyoung Soon
  • 이기선 LEE, Gi Seon
  • 황현민 HWANG, Hyun Min
  • 박아름 PARK, Ah Rum
Agents
  • 한상수 HAN, Sang Soo
Priority Data
10-2018-017419931.12.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE POSITIVE
(KO) 포지티브형 감광성 수지 조성물
Abstract
(EN)
A positive photosensitive resin composition of the present invention comprises: a siloxane-based polymer obtained by polymerization of one or more reactive silanes; an olefin-based polymer comprising repeating units comprising one or more hydroxyphenyl groups or phenyl groups; a 1,2-quinone diazide compound; and a solvent. The positive photosensitive resin composition of the present invention has excellent performance in terms of sensitivity, thermochromic resistance, and the like, and in particular, has excellent heat resistance such that, when used in display panels, excellent panel reliability may be secured due to the improvement in cracks and heat resistance.
(FR)
La présente invention concerne une composition de résine photosensible positive qui comprend : un polymère à base de siloxane obtenu par la polymérisation d'un ou de plusieurs silanes réactifs ; un polymère à base d'oléfine comprenant des motifs récurrents comprenant un ou plusieurs groupes hydroxyphényle ou groupes phényle ; un composé 1,2-quinone diazide ; et un solvant. La composition de résine photosensible positive de la présente invention présente d'excellentes performances en termes de sensibilité, de résistance thermochromique et autres propriétés analogues, en particulier une excellente résistance à la chaleur, de telle sorte que, lorsqu'elle est utilisée dans des panneaux d'affichage, une excellente fiabilité de panneau peut être assurée en raison de l'amélioration de la résistance aux fissures et à la chaleur.
(KO)
본 발명의 포지티브형 감광성 수지 조성물은 1종 이상의 반응성 실란을 중합하여 얻어진 실록산계 중합체; 1종 이상의 하이드록시 페닐기 또는 페닐기를 포함하는 반복단위를 포함하는 올레핀계 중합체; 1,2-퀴논디아지드 화합물; 및 용매를 포함한다. 본 발명의 포지티브형 감광성 수지 조성물은 감도, 내열변색성 등 성능이 우수할 뿐만 아니라, 특히 뛰어난 내열성으로 인해 이를 디스플레이 패널에 사용되는 경우 크랙 및 내화학성이 향상되어 우수한 패널 신뢰성을 확보할 수 있다.
Also published as
Latest bibliographic data on file with the International Bureau