Processing

Please wait...

PATENTSCOPE will be unavailable a few hours for maintenance reason on Tuesday 27.07.2021 at 12:00 PM CEST
Settings

Settings

Goto Application

1. WO2020141804 - CHEMICAL-MECHANICAL POLISHING PARTICLE AND POLISHING SLURRY COMPOSITION COMPRISING SAME

Publication Number WO/2020/141804
Publication Date 09.07.2020
International Application No. PCT/KR2019/018546
International Filing Date 27.12.2019
IPC
C09K 3/14 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3Materials not provided for elsewhere
14Anti-slip materials; Abrasives
C09G 1/04 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
GPOLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES
1Polishing compositions
04Aqueous dispersions
CPC
C09G 1/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
GPOLISHING COMPOSITIONS
1Polishing compositions
02containing abrasives or grinding agents
C09G 1/04
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
GPOLISHING COMPOSITIONS
1Polishing compositions
04Aqueous dispersions
C09K 3/14
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
3Materials not provided for elsewhere
14Anti-slip materials; Abrasives
Applicants
  • 주식회사 동진쎄미켐 DONGJIN SEMICHEM CO., LTD. [KR]/[KR]
Inventors
  • 문원균 MOON, Weoun Gyuen
  • 김재현 KIM, Jae Hyun
  • 신규순 SHIN, Kyu Soon
  • 박종대 PARK, Jong Dai
  • 이민건 LEE, Min Gun
  • 진성훈 JIN, Sung Hoon
  • 이구화 LEE, Goo Hwa
  • 조경숙 CHO, Gyeong Sook
  • 유재홍 YOO, Jae Hong
Agents
  • 특허법인 태웅 TW INTERNATIONAL PATENT AND LAWFIRM
Priority Data
10-2018-017379631.12.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) CHEMICAL-MECHANICAL POLISHING PARTICLE AND POLISHING SLURRY COMPOSITION COMPRISING SAME
(FR) PARTICULE DE POLISSAGE CHIMICO-MÉCANIQUE ET COMPOSITION DE SUSPENSION DE POLISSAGE LA COMPRENANT
(KO) 화학-기계적 연마 입자 및 이를 포함하는 연마 슬러리 조성물
Abstract
(EN)
The present invention provides a chemical-mechanical polishing particle having high polishing quality with a high polishing rate and few defects or scratches by modifying the surface of a polishing particle, and a polishing slurry composition comprising same.
(FR)
La présente invention concerne une particule de polissage chimico-mécanique ayant une qualité de polissage élevée avec un taux de polissage élevé et peu de défauts ou de rayures par modification de la surface d'une particule de polissage, et une composition de suspension de polissage la comprenant.
(KO)
본 발명은 연마 입자의 표면을 개질하여, 높은 연마 속도, 결점이나 스크래치가 작은 양질의 연마 품질을 갖는 화학-기계적 연마 입자 및 이를 포함하는 연마 슬러리 조성물을 제공한다.
Also published as
Latest bibliographic data on file with the International Bureau