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1. WO2020141760 - SPEAKER MODULE MOUNTING STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME

Publication Number WO/2020/141760
Publication Date 09.07.2020
International Application No. PCT/KR2019/017808
International Filing Date 16.12.2019
IPC
H04M 1/02 2006.1
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
MTELEPHONIC COMMUNICATION
1Substation equipment, e.g. for use by subscribers
02Constructional features of telephone sets
H05K 5/00 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5Casings, cabinets or drawers for electric apparatus
H05K 5/03 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5Casings, cabinets or drawers for electric apparatus
02Details
03Covers
CPC
H04M 1/02
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
MTELEPHONIC COMMUNICATION
1Substation equipment, e.g. for use by subscribers
02Constructional features of telephone sets
H05K 5/00
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5Casings, cabinets or drawers for electric apparatus
H05K 5/03
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5Casings, cabinets or drawers for electric apparatus
02Details
03Covers
Applicants
  • 삼성전자 주식회사 SAMSUNG ELECTRONICS CO., LTD. [KR]/[KR]
Inventors
  • 이명철 LEE, Myungcheol
  • 곽민영 GWAK, Minyoung
  • 김현학 KIM, Hyeonhak
  • 박영배 PARK, Youngbae
  • 정종진 JEONG, Jongjin
  • 조성호 CHO, Seongho
  • 황호철 HWANG, Hochul
Agents
  • 이건주 LEE, Keon-Joo
  • 김정훈 KIM, Jeoung-Hoon
Priority Data
10-2019-000114104.01.2019KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) SPEAKER MODULE MOUNTING STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME
(FR) STRUCTURE DE MONTAGE DE MODULE HAUT-PARLEUR ET DISPOSITIF ÉLECTRONIQUE LA COMPRENANT
(KO) 스피커 모듈의 실장 구조 및 이를 포함하는 전자 장치
Abstract
(EN)
An electronic device according to various embodiments of the present disclosure can comprise: a housing comprising a front plate facing a first direction, a back plate facing a second direction that is opposite the first direction, and an outer wall which encompasses the space between the front plate and the back plate and in which a pipe passage extending to the outside is arranged; a speaker module positioned in the space, which is adjacent to the pipe passage; a printed circuit board arranged along at least a part of the side surface of the speaker module and formed along the periphery of the region between the outer wall, having the pipe passage, and the speaker module; and a first sealing member arranged between the back plate and a bracket and formed into a closed loop along the edge of the speaker module. Other embodiments also can be possible.
(FR)
Selon divers modes de réalisation, la présente invention concerne un dispositif électronique pouvant comprendre : un boîtier comprenant une plaque avant orientée dans un premier sens, une plaque arrière orientée dans un second sens contraire au premier sens, et une paroi externe qui englobe l'espace entre la plaque avant et la plaque arrière et dans laquelle est ménagé un passage de conduite s'étendant vers l'extérieur ; un module de haut-parleur positionné dans l'espace, qui est adjacent au passage de conduite ; une carte de circuit imprimé disposée le long d'au moins une partie de la surface latérale du module de haut-parleur et formée le long de la périphérie de la région entre la paroi extérieure, comportant le passage de conduite, et le module de haut-parleur ; et un premier élément d'étanchéité disposé entre la plaque arrière et un support et formé en une boucle fermée le long du bord du module de haut-parleur. D'autres modes de réalisation sont également possibles.
(KO)
본 개시의 다양한 실시예에 따른 전자 장치는, 제 1 방향으로 향하는 전면 플레이트, 상기 제 1 방향의 반대 방향인 제 2 방향으로 향하는 후면 플레이트, 및 상기 전면 플레이트와 상기 후면 플레이트 사이의 공간을 둘러싸고 외부로 연장된 관로가 배치된 외벽을 포함하는 하우징, 상기 관로와 인접한 상기 공간 내에 위치한 스피커 모듈, 상기 스피커 모듈의 측면의 적어도 일부를 따라 배치되고, 상기 관로가 형성된 상기 외벽 및 상기 스피커 모듈 사이의 영역 주변을 따라 형성된 인쇄 회로 기판 및 상기 후면 플레이트와 상기 브라켓 사이에 배치되고, 상기 스피커 모듈의 가장자리를 따라 폐곡선으로 형성된 제 1 실링 부재를 포함할 수 있다. 다른 실시 예도 가능할 수 있다.
Also published as
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