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1. WO2020141347 - ULTRA-SMOOTH SIDEWALL PIXELATED ARRAY LEDS

Publication Number WO/2020/141347
Publication Date 09.07.2020
International Application No. PCT/IB2019/001380
International Filing Date 23.12.2019
IPC
H01L 33/50 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
50Wavelength conversion elements
CPC
H01L 25/0753
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
03all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
04the devices not having separate containers
075the devices being of a type provided for in group H01L33/00
0753the devices being arranged next to each other
H01L 27/156
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
15including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
153in a repetitive configuration, e.g. LED bars
156two-dimensional arrays
H01L 2933/0025
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2933Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
0008Processes
0025relating to coatings
H01L 2933/0033
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2933Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
0008Processes
0033relating to semiconductor body packages
H01L 2933/0041
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2933Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
0008Processes
0033relating to semiconductor body packages
0041relating to wavelength conversion elements
H01L 2933/0058
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2933Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
0008Processes
0033relating to semiconductor body packages
0058relating to optical field-shaping elements
Applicants
  • LUMILEDS HOLDING B.V. [NL]/[NL]
Inventors
  • MASUI, Hisashi
  • SHIMIZU, Kentaro
  • DOHNER, Emma
Priority Data
16/358,09219.03.2019US
62/787,05331.12.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ULTRA-SMOOTH SIDEWALL PIXELATED ARRAY LEDS
(FR) DEL EN RÉSEAU PIXELISÉES À PAROIS LATÉRALES ULTRA-LISSES
Abstract
(EN)
Pixelated array light emitters are formed with closely-spaced pixels having ultrasmooth sidewalls. In methods for making such pixelated array light emitters, a converter layer of phosphor particles dispersed in a binder is disposed on a carrier, and then singulated by saw cuts or similar methods to form an array of phosphor pixels. The binder is fully cured prior to singulation of the converter layer. Further, the carrier is rigid rather than flexible. As a consequence of fully curing the binder and of using a rigid carrier to support the converter layer, singulation results in phosphor pixels having smooth side walls. The array of phosphor pixels is subsequently attached to a corresponding array of LEDs with an adhesive layer, separate from the binder used to form the converter layer. The pixel sidewalls may be formed with controlled morphology, for example at acute or obtuse angles with respect to the carrier.
(FR)
Des émetteurs de lumière en réseau pixelisés sont formés, présentant des pixels étroitement espacés ayant des parois latérales ultra-lisses. Dans des procédés de fabrication de tels émetteurs de lumière en réseau pixelisés, une couche de convertisseur de particules de phosphore dispersées dans un liant est disposée sur un support, puis séparée par des coupes à la scie ou des procédés similaires pour former un réseau de pixels de phosphore. Le liant est entièrement durci avant la séparation de la couche de convertisseur. En outre, le support est rigide plutôt que flexible. En conséquence du durcissement complet du liant et de l'utilisation d'un support rigide pour supporter la couche de convertisseur, la séparation permet d'obtenir des pixels de phosphore ayant des parois latérales lisses. Le réseau de pixels de phosphore est ensuite fixé à un réseau correspondant de DEL avec une couche adhésive, séparée du liant utilisé pour former la couche de convertisseur. Les parois latérales de pixels peuvent être formées avec une morphologie contrôlée, par exemple à des angles aigus ou obtus par rapport au support.
Also published as
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