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1. WO2020141331 - IMPROVEMENTS IN OR RELATING TO FLEXIBLE ELECTRONICS

Publication Number WO/2020/141331
Publication Date 09.07.2020
International Application No. PCT/GB2020/050014
International Filing Date 06.01.2020
IPC
H05K 3/04 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
02in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
04the conductive material being removed mechanically, e.g. by punching
H05K 1/03 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
H05K 3/46 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
CPC
H05K 1/0393
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
03Use of materials for the substrate
0393Flexible materials
H05K 2201/055
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
05Flexible printed circuits [FPCs]
055Folded back on itself
H05K 2203/013
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
01Tools for processing; Objects used during processing
0104for patterning or coating
013Inkjet printing, e.g. for printing insulating material or resist
H05K 2203/0152
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
01Tools for processing; Objects used during processing
0147Carriers and holders
0152Temporary metallic carrier, e.g. for transferring material
H05K 2203/0156
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
01Tools for processing; Objects used during processing
0147Carriers and holders
0156Temporary polymeric carrier or foil, e.g. for processing or transferring
H05K 2203/0522
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
05Patterning and lithography; Masks; Details of resist
0502Patterning and lithography
0522Using an adhesive pattern
Applicants
  • SHERKIN TECHNOLOGIES UK LTD [GB]/[GB]
Inventors
  • O' SULLIVAN, Donal
Agents
  • WILSON GUNN (MANCHESTER)
Priority Data
1900135.304.01.2019GB
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) IMPROVEMENTS IN OR RELATING TO FLEXIBLE ELECTRONICS
(FR) PERFECTIONNEMENTS APPORTÉS OU SE RAPPORTANT À UNE ÉLECTRONIQUE FLEXIBLE
Abstract
(EN)
An electronic assembly (1) comprises a substrate (2), an adhesive pattern (3) applied on at least one surface of the substrate (2), the adhesive pattern (3) corresponding a desired conductive track; and a conductive foil (4) applied on top of the adhesive pattern. In a particular embodiment a conductive trace (4) has end contact (48) formed on a body portion (28) of substrate (2) and a second end contact (49) formed on an arm portion (29) of substrate (2). By making a fold along line (9), the arm portion (29) can be bent over the body portion (28) allowing the end contacts (48, 49) to come into contact.
(FR)
Un ensemble électronique (1) comprend un substrat (2), un motif adhésif (3) appliqué sur au moins une surface du substrat (2), le motif adhésif (3) correspondant à une piste conductrice souhaitée ; et une feuille conductrice (4) appliquée sur le dessus du motif adhésif. Dans un mode de réalisation particulier, une piste conductrice (4) a un contact d'extrémité (48) formé sur une partie corps (28) du substrat (2) et un second contact d'extrémité (49) formé sur une partie bras (29) du substrat (2). En réalisant un pli le long de la ligne (9), la partie bras (29) peut être courbée sur la partie corps (28), permettant aux contacts d'extrémité (48, 49) de venir au contact l'un de l'autre.
Latest bibliographic data on file with the International Bureau