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1. WO2020140727 - LED DISPLAY DEVICE

Publication Number WO/2020/140727
Publication Date 09.07.2020
International Application No. PCT/CN2019/125098
International Filing Date 13.12.2019
IPC
G09F 9/33 2006.1
GPHYSICS
09EDUCATING; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
33being semiconductor devices, e.g. diodes
H01L 25/16 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
16the devices being of types provided for in two or more different main groups of groups H01L27/-H01L51/139
CPC
G09F 9/33
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
9Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
30in which the desired character or characters are formed by combining individual elements
33being semiconductor devices, e.g. diodes
G09G 2300/0426
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
2300Aspects of the constitution of display devices
04Structural and physical details of display devices
0421Structural details of the set of electrodes
0426Layout of electrodes and connections
G09G 2300/0452
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
2300Aspects of the constitution of display devices
04Structural and physical details of display devices
0439Pixel structures
0452Details of colour pixel setup, e.g. pixel composed of a red, a blue and two green components
G09G 3/32
GPHYSICS
09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
3Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
20for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix ; no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
22using controlled light sources
30using electroluminescent panels
32semiconductive, e.g. using light-emitting diodes [LED]
H01L 2224/49431
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
49of a plurality of wire connectors
494Connecting portions
4943the connecting portions being staggered
49431on the semiconductor or solid-state body
H01L 2224/49433
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
49of a plurality of wire connectors
494Connecting portions
4943the connecting portions being staggered
49433outside the semiconductor or solid-state body
Applicants
  • 京东方科技集团股份有限公司 BOE TECHNOLOGY GROUP CO., LTD. [CN]/[CN]
  • 北京京东方显示技术有限公司 BEIJING BOE DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 曹鹏军 CAO, Pengjun
  • 翟明 ZHAI, Ming
  • 李沛 LI, Pei
  • 王志远 WANG, Zhiyuan
  • 李金鹏 LI, Jinpeng
  • 李丹 LI, Dan
  • 李健 LI, Jian
  • 张腾 ZHANG, Teng
Agents
  • 北京天昊联合知识产权代理有限公司 TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS
Priority Data
201910008987.404.01.2019CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) LED DISPLAY DEVICE
(FR) DISPOSITIF D’AFFICHAGE À LED
(ZH) LED显示装置
Abstract
(EN)
An LED display device, comprising: an LED display substrate (1) and a drive substrate (2) opposite to each other. The LED display substrate (1) comprises: a substrate (3) and a plurality of LED chips (5), the plurality of LED chips (5) being located on one side of the substrate (3) distant from the drive substrate (2); the drive substrate (2) comprises: a PCB board (4) and a drive control component (11), the drive control component (11) being located on the PCB board (4), and the drive control component (11) being electrically connected to the plurality of LED chips (5) by means of a plurality of first signal wires (6) to provide a drive signal to the LED chips (5).
(FR)
La présente invention concerne un dispositif d'affichage à LED qui comprend : un substrat d'affichage à LED (1) et un substrat d'excitation (2) opposés l'un à l'autre. Le substrat d'affichage à LED (1) comprend : un substrat (3) et une pluralité de puces de LED (5), la pluralité de puces de LED (5) étant située sur un côté du substrat (3) distant du substrat d'excitation (2) ; le substrat d'excitation (2) comprend : une carte PCB (4) et un composant de commande d'excitation (11), le composant de commande d'excitation (11) étant situé sur la carte PCB (4), et le composant de commande d'excitation (11) étant électriquement connecté à la pluralité de puces de LED (5) au moyen d'une pluralité de premiers fils de signal (6) pour fournir un signal de commande aux puces de LED (5).
(ZH)
一种LED显示装置,包括:相对设置的LED显示基板(1)和驱动基板(2);LED显示基板(1)包括:衬底(3)和多个LED芯片(5),多个LED芯片(5)位于衬底(3)远离驱动基板(2)的一侧;驱动基板(2)包括:PCB板(4)和驱动控制器件(11),驱动控制器件(11)位于PCB板(4)上,驱动控制器件(11)通过多条第一信号走线(6)与多个LED芯片(5)电连接以向各LED芯片(5)提供驱动信号。
Also published as
Latest bibliographic data on file with the International Bureau