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1. WO2020140574 - MEMS MICROPHONE MANUFACTURING METHOD

Publication Number WO/2020/140574
Publication Date 09.07.2020
International Application No. PCT/CN2019/113335
International Filing Date 25.10.2019
IPC
H04R 31/00 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
31Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
CPC
B81B 2201/0257
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
02Sensors
0257Microphones or microspeakers
B81B 2203/0127
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2203Basic microelectromechanical structures
01Suspended structures, i.e. structures allowing a movement
0127Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
B81B 2203/0315
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2203Basic microelectromechanical structures
03Static structures
0315Cavities
B81B 2203/04
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2203Basic microelectromechanical structures
04Electrodes
B81B 3/001
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
3Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
0002Arrangements for avoiding sticking of the flexible or moving parts
001Structures having a reduced contact area, e.g. with bumps or with a textured surface
B81B 3/0021
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
3Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
0018Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
0021Transducers for transforming electrical into mechanical energy or vice versa
Applicants
  • 瑞声声学科技(深圳)有限公司 AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. [CN]/[CN]
  • 瑞声科技(新加坡)有限公司 AAC TECHNOLOGIES PTE. LTD. [SG]/[SG]
Inventors
  • 孟珍奎 MENG, Zhenkui
  • 刘政谚 LIU, Zhengyan
Agents
  • 广州市越秀区哲力专利商标事务所(普通合伙) GUANGZHOU YUEXIU JILY PATENT & TRADEMARK LAW OFFICE
Priority Data
201811651276.031.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) MEMS MICROPHONE MANUFACTURING METHOD
(FR) PROCÉDÉ DE FABRICATION DE MICROPHONE MEMS
(ZH) MEMS 麦克风制造方法
Abstract
(EN)
The present invention provides an MEMS microphone manufacturing method. The method comprises the following steps: selecting a substrate and preparing a first diaphragm structure on a first surface of the substrate; preparing a back plate structure at intervals at a side surface of the first diaphragm structure opposite the first surface of the substrate, a first gap being provided between the first diaphragm structure and the back plate structure; preparing a second diaphragm structure at a side surface of the back plate structure opposite the first diaphragm structure, a second gap being provided between the second diaphragm structure and the back plate structure; preparing an electrode at a side surface of the second diaphragm structure opposite the back plate structure; and etching a second surface of the substrate opposite the first surface thereof to form a back cavity.
(FR)
La présente invention concerne un procédé de fabrication d'un microphone MEMS. Le procédé comprend les étapes suivantes consistant à : sélectionner un substrat et préparer une première structure de diaphragme sur une première surface du substrat ; préparer une structure de plaque arrière à des intervalles sur une surface latérale de la première structure de diaphragme opposée à la première surface du substrat, un premier espace étant prévu entre la première structure de diaphragme et la structure de plaque arrière ; préparer une seconde structure de diaphragme au niveau d'une surface latérale de la structure de plaque arrière opposée à la première structure de diaphragme, un second espace étant prévu entre la seconde structure de diaphragme et la structure de plaque arrière ; préparer une électrode au niveau d'une surface latérale de la seconde structure de diaphragme opposée à la structure de plaque arrière ; et graver une seconde surface du substrat opposée à la première surface de celui-ci pour former une cavité arrière.
(ZH)
本发明提出一种MEMS麦克风的制备方法,包括如下步骤:选择基底,在所述基底的第一表面上制备第一振膜结构;在所述第一振膜结构的与所述基底的第一表面相对的侧面间隔制备背板结构,所述第一振膜结构与所述背板结构之间具有第一间隙;在所述背板结构的与所述第一振膜结构相对的侧面间隔制备第二振膜结构,所述第二振膜结构与所述背板结构之间具有第二间隙;在所述第二振膜结构的与所述背板结构相对的侧面制备电极;刻蚀所述基底的与所述第一表面相对的第二表面,形成背腔。
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