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1. WO2020140573 - MEMS MICROPHONE

Publication Number WO/2020/140573
Publication Date 09.07.2020
International Application No. PCT/CN2019/113331
International Filing Date 25.10.2019
IPC
H04R 1/08 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1Details of transducers
08Mouthpieces; Attachments therefor
H04R 7/08 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
7Diaphragms for electromechanical transducers; Cones
02characterised by the construction
04Plane diaphragms
06comprising a plurality of sections or layers
08comprising superposed layers separated by air or other fluid
CPC
B81B 2201/0257
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
02Sensors
0257Microphones or microspeakers
B81B 2203/0127
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2203Basic microelectromechanical structures
01Suspended structures, i.e. structures allowing a movement
0127Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
B81B 3/001
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
3Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
0002Arrangements for avoiding sticking of the flexible or moving parts
001Structures having a reduced contact area, e.g. with bumps or with a textured surface
B81B 3/0021
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
3Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
0018Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
0021Transducers for transforming electrical into mechanical energy or vice versa
H04R 19/005
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
005using semiconductor materials
H04R 19/04
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
04Microphones
Applicants
  • 瑞声声学科技(深圳)有限公司 AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. [CN]/[CN]
  • 瑞声科技(新加坡)有限公司 AAC TECHNOLOGIES PTE. LTD. [SG]/[SG]
Inventors
  • 孟珍奎 MENG, Zhenkui
  • 刘政谚 LIU, Zhengyan
Agents
  • 广州市越秀区哲力专利商标事务所(普通合伙) GUANGZHOU YUEXIU JILY PATENT & TRADEMARK LAW OFFICE
Priority Data
201822278387.331.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) MEMS MICROPHONE
(FR) MICROPHONE MEMS
(ZH) MEMS麦克风
Abstract
(EN)
Provided in the present utility model is an MEMS microphone, comprising a substrate with a back cavity, and a capacitor system arranged on the substrate. The capacitor system comprises a back plate, and a first diaphragm and a second diaphragm arranged opposite the back plate and respectively arranged on two sides of the back plate, wherein the first diaphragm and the second diaphragm are spaced apart from the back plate, and respectively form a first insulation gap and a second insulation gap; the back plate is provided with multiple through holes; and the first diaphragm and the second diaphragm are of a circular shape. The MEMS microphone further comprises a first support member passing through the through hole and arranged between the first diaphragm and the second diaphragm, with one end of the first support member being connected to the center of the first diaphragm, and the other end being connected to the center of the second diaphragm. By means of providing the support member, unnecessary deflection of the diaphragms is effectively avoided, and the overall sensitivity and signal-to-noise ratio of the MEMS microphone are improved.
(FR)
Le présent modèle d'utilité est un microphone MEMS, comprenant un substrat avec une cavité arrière, et un système de condensateur disposé sur le substrat. Le système de condensateur comprend une plaque arrière, et une première membrane et une deuxième membrane disposées à l'opposé de la plaque arrière et disposées respectivement sur deux côtés de la plaque arrière, dans lequel la première membrane et la deuxième membrane sont espacées de la plaque arrière, et forment respectivement un premier espace d'isolation et un deuxième espace d'isolation; la plaque arrière est pourvue de multiples trous traversants; et la première membrane et la deuxième membrane sont de forme circulaire. Le microphone MEMS comprend en outre un premier élément de support traversant le trou de passage et disposé entre la première et la deuxième membrane, une extrémité du premier élément de support étant reliée au centre de la première membrane, et l'autre extrémité étant reliée au centre de la deuxième membrane. En fournissant l'élément de soutien, une déviation inutile des membranes est efficacement évitée, et la sensibilité globale et le rapport signal/bruit du microphone MEMS sont améliorés.
(ZH)
本实用新型提供一种MEMS麦克风,包括具有背腔的基底以及设于所述基底上的电容系统,所述电容系统包括背板以及与所述背板相对且分别设置在所述背板两侧的第一振膜和第二振膜,所述第一振膜和第二振膜与背板间隔设置并分别形成第一绝缘间隙和第二绝缘间隙,所述背板开设有若干个通孔,所述第一振膜和所述第二振膜为圆形,所述MEMS麦克风还包括贯穿所述通孔设置于所述第一振膜与所述第二振膜之间的第一支撑件,所述第一支撑件的一端连接于所述第一振膜的圆心,另一端连接于所述第二振膜的圆心。通过设置支撑件,有效避免了振膜不必要的偏转,提高了MEMS麦克风的整体灵敏度和信噪比。
Also published as
Latest bibliographic data on file with the International Bureau