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1. WO2020140572 - METHOD FOR MANUFACTURING MEMS MICROPHONE

Publication Number WO/2020/140572
Publication Date 09.07.2020
International Application No. PCT/CN2019/113322
International Filing Date 25.10.2019
IPC
H04R 31/00 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
31Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
H04R 19/04 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
04Microphones
CPC
H04R 19/005
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
005using semiconductor materials
H04R 19/04
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
04Microphones
H04R 2201/003
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
2201Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
003Mems transducers or their use
H04R 2307/025
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
2307Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
025Diaphragms comprising polymeric materials
H04R 2499/11
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
2499Aspects covered by H04R or H04S not otherwise provided for in their subgroups
10General applications
11Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
H04R 31/00
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
31Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
Applicants
  • 瑞声声学科技(深圳)有限公司 AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. [CN]/[CN]
  • 瑞声科技(新加坡)有限公司 AAC TECHNOLOGIES PTE. LTD. [SG]/[SG]
Inventors
  • 孟珍奎 MENG, Zhenkui
  • 刘政谚 LIU, Zhengyan
Agents
  • 广州市越秀区哲力专利商标事务所(普通合伙) GUANGZHOU YUEXIU JILY PATENT & TRADEMARK LAW OFFICE
Priority Data
201811651259.731.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) METHOD FOR MANUFACTURING MEMS MICROPHONE
(FR) PROCÉDÉ DE FABRICATION D'UN MICROPHONE MEMS
(ZH) MEMS麦克风制造方法
Abstract
(EN)
Provided is a method for manufacturing an MEMS microphone, the method comprising the following steps: selecting a substrate, and manufacturing a first diaphragm structure on a first surface of the substrate; manufacturing back plate structures at intervals on a side surface, opposite the first surface of the substrate, of the first diaphragm structure, with first gaps being provided between the first diaphragm structure and the back plate structures; manufacturing second diaphragm structures at intervals on a side surface, opposite the first diaphragm structure, of the back plate structures, with second gaps being provided between the second diaphragm structures and the back plate structures; manufacturing an electrode on a side surface, opposite the back plate structures, of the second diaphragm structures; and etching a second surface, opposite the first surface, of the substrate to form a back cavity.
(FR)
L'invention concerne un procédé de fabrication d'un microphone MEMS, le procédé comprenant les étapes suivantes consistant à : sélectionner un substrat, et fabriquer une première structure de membrane sur une première surface du substrat; fabriquer des structures de plaque arrière à intervalles sur une surface latérale, opposée à la première surface du substrat, de la première structure de membrane, des premiers espaces étant prévus entre la première structure de membrane et les structures de plaque arrière; fabriquer des secondes structures de membrane à intervalles sur une surface latérale, opposée à la première structure de membrane, des structures de plaque arrière, avec des seconds espaces étant prévus entre les secondes structures de membrane et les structures de plaque arrière; fabriquer une électrode sur une surface latérale, opposée aux structures de plaque arrière, des secondes structures de membrane; et graver une seconde surface, opposée à la première surface, du substrat pour former une cavité arrière.
(ZH)
本发明提出一种MEMS麦克风的制备方法,包括如下步骤:选择基底,在所述基底的第一表面上制备第一振膜结构;在所述第一振膜结构的与所述基底的第一表面相对的侧面间隔制备背板结构,所述第一振膜结构与所述背板结构之间具有第一间隙;在所述背板结构的与所述第一振膜结构相对的侧面间隔制备第二振膜结构,所述第二振膜结构与所述背板结构之间具有第二间隙;在所述第二振膜结构的与所述背板结构相对的侧面制备电极;刻蚀所述基底的与所述第一表面相对的第二表面,形成背腔。
Also published as
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