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1. WO2020140571 - MEMS MICROPHONE

Publication Number WO/2020/140571
Publication Date 09.07.2020
International Application No. PCT/CN2019/113317
International Filing Date 25.10.2019
IPC
H04R 7/02 2006.1
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
7Diaphragms for electromechanical transducers; Cones
02characterised by the construction
H04R 7/04 2006.1
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
7Diaphragms for electromechanical transducers; Cones
02characterised by the construction
04Plane diaphragms
CPC
H04R 1/021
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1Details of transducers, ; loudspeakers or microphones
02Casings; Cabinets ; ; Supports therefor;; Mountings therein
021incorporating only one transducer
H04R 1/2823
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1Details of transducers, ; loudspeakers or microphones
20Arrangements for obtaining desired frequency or directional characteristics
22for obtaining desired frequency characteristic only
28Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
2807Enclosures comprising vibrating or resonating arrangements
2815of the bass reflex type
2823Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material
H04R 19/005
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
005using semiconductor materials
H04R 19/04
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
04Microphones
H04R 2201/003
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
2201Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
003Mems transducers or their use
H04R 2410/03
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
2410Microphones
03Reduction of intrinsic noise in microphones
Applicants
  • 瑞声声学科技(深圳)有限公司 AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. [CN]/[CN]
  • 瑞声科技(新加坡)有限公司 AAC TECHNOLOGIES PTE. LTD. [SG]/[SG]
Inventors
  • 孟珍奎 MENG, Zhenkui
  • 刘政谚 LIU, Zhengyan
Agents
  • 广州市越秀区哲力专利商标事务所(普通合伙) GUANGZHOU YUEXIU JILY PATENT & TRADEMARK LAW OFFICE
Priority Data
201822279342.831.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) MEMS MICROPHONE
(FR) MICROPHONE MEMS
(ZH) 一种MEMS麦克风
Abstract
(EN)
The utility model provides an MEMS microphone, which comprises a substrate with a back chamber and a capacitance system arranged on the substrate, wherein the capacitance system comprises a back plate, and a first diaphragm and a second diaphragm, which are opposite to the back plate and are arranged on the upper and lower sides of the back plate. The MEMS microphone comprises an insulating layer that isolates the substrate, the back plate, the first diaphragm and the second diaphragm from each other; a sealing space is formed between the first diaphragm and the second diaphragm, and the intensity of pressure in the sealing space is equal to the intensity of external pressure, which effectively avoids the influence of the environmental pressure on the diaphragms and improves reliability and sensitivity of the device.
(FR)
Le présent modèle d'utilité concerne un microphone MEMS, qui comprend un substrat avec une chambre arrière et un système de capacité disposé sur le substrat, le système de capacité comprenant une plaque arrière, et une première membrane et une seconde membrane, qui sont opposés à la plaque arrière et qui sont disposés sur les côtés supérieur et inférieur de la plaque arrière. Le microphone MEMS comprend une couche isolante qui isole le substrat, la plaque arrière, la première membrane et la seconde membrane les uns des autres; un espace d'étanchéité est formé entre la première membrane et la seconde membrane, et l'intensité de la pression dans l'espace d'étanchéité est égale à l'intensité de la pression externe, ce qui évite efficacement l'influence de la pression environnante sur les membranes et améliore la fiabilité et la sensibilité du dispositif.
(ZH)
本实用新型提出一种MEMS麦克风,包括具有背腔的基底以及设于所述基底上的电容系统,所述电容系统包括背板以及与所述背板相对且设置在所述背板上下两侧的第一振膜和第二振膜,所述MEMS麦克风包括隔离所述基底、所述背板、所述第一振膜、所述第二振膜的绝缘层;所述第一振膜与所述第二振膜之间形成密封空间,且所述密封空间内的压强等于外界压强,有效避免了环境压力对振膜的影响,提高了器件的可靠性和灵敏度。
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