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1. WO2020140494 - PIXEL STRUCTURE, DISPLAY SCREEN AND METAL MASK

Publication Number WO/2020/140494
Publication Date 09.07.2020
International Application No. PCT/CN2019/108326
International Filing Date 27.09.2019
IPC
H01L 27/32 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
C23C 14/04 2006.1
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
04Coating on selected surface areas, e.g. using masks
C23C 14/24 2006.1
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
CPC
C23C 14/04
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
04Coating on selected surface areas, e.g. using masks
C23C 14/24
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
H01L 27/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
H01L 27/3218
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3206Multi-colour light emission
3211using RGB sub-pixels
3218characterised by the geometrical arrangement of the RGB sub-pixels
Applicants
  • TCL科技集团股份有限公司 TCL TECHNOLOGY GROUP CORPORATION [CN]/[CN]
Inventors
  • 张滔 ZHANG, Tao
  • 向超宇 XIANG, Chaoyu
  • 朱佩 ZHU, Pei
  • 罗植天 LUO, Zhitian
Agents
  • 深圳市君胜知识产权代理事务所(普通合伙) JOHNSON INTELLECTUAL PROPERTY AGENCY(SHENZHEN)
Priority Data
201811643518.130.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) PIXEL STRUCTURE, DISPLAY SCREEN AND METAL MASK
(FR) STRUCTURE DE PIXELS, ÉCRAN D'AFFICHAGE ET MASQUE MÉTALLIQUE
(ZH) 一种像素结构、显示屏及金属掩模板
Abstract
(EN)
A pixel structure, a display screen and a metal mask, wherein the pixel structure comprises three types of single-color main sub-pixels (1) and three types of compensation sub-pixels (2), and the six types of sub-pixels are arranged according to a prescribed order in a first direction (a) and a second direction (b) perpendicular to the first direction (a). During evaporation, a new pixel structure enables a pattern formed by an adjacent single-color sub-pixel configuration to be formed by means of an opening of a metal mask, so that an opening of a mask pattern on the mask is enlarged, which thus increases the resolution of the display screen. At the same time, by means of shared compensation sub-pixels (2), the differences of decay of devices of different colors is adjusted, the offset of white balance is reduced, and the display effect is improved.
(FR)
Structure de pixels, écran d'affichage et masque métallique, la structure de pixels comprenant trois types de sous-pixels principaux de couleur unique (1) et trois types de sous-pixels de compensation (2), et les six types de sous-pixels sont agencés selon un ordre prescrit dans une première direction (a) et une seconde direction (b) perpendiculaire à la première direction (a). Pendant l'évaporation, une nouvelle structure de pixels permet de former un motif formé par une configuration de sous-pixels de couleur unique adjacente à l'aide d'une ouverture d'un masque métallique, de telle sorte qu'une ouverture d'un motif de masque sur le masque est agrandie, ce qui augmente ainsi la résolution de l'écran d'affichage. En même temps, à l'aide de sous-pixels de compensation (2) partagés, les différences de décroissance de dispositifs de couleurs différentes sont ajustées, le décalage de l'équilibre des blancs est réduit, et l'effet d'affichage est amélioré.
(ZH)
一种像素结构、显示屏及金属掩膜版,其中,像素结构包括三种单色的主子像素(1)和三种补偿子像素(2),六种子像素在第一方向(a)以及垂直于所述第一方向(a)的第二方向(b)上按照规定的顺序排列。在蒸镀过程中,新像素结构使相邻的同色子像素排布形成的图形通过金属掩模板的一个开口形成,使掩模板上的掩模图形开口增大,提高了显示屏的分辨率;同时通过共用的补偿子像素(2),调节不同颜色器件的衰退差异,减少白色平衡的偏差,提高了显示效果。
Also published as
Latest bibliographic data on file with the International Bureau