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1. WO2020140367 - SOLDER PASTE LASER-INDUCED FORWARD TRANSFER DEVICE AND METHOD

Publication Number WO/2020/140367
Publication Date 09.07.2020
International Application No. PCT/CN2019/088109
International Filing Date 23.05.2019
IPC
G02B 27/09 2006.01
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
27Optical systems or apparatus not provided for by any of the groups G02B1/-G02B26/119
09Beam shaping, e.g. changing the cross-sectioned area, not otherwise provided for
G02B 26/10 2006.01
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
26Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating or modulating
08for controlling the direction of light
10Scanning systems
C23C 14/28 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
28by wave energy or particle radiation
CPC
B23K 1/0056
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
005Soldering by means of radiant energy
0056soldering by means of beams, e.g. lasers, E.B.
B23K 1/20
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
B23K 1/203
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
203Fluxing, i.e. applying flux onto surfaces
B23K 26/0006
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
0006taking account of the properties of the material involved
B23K 26/0622
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
062by direct control of the laser beam
0622by shaping pulses
B23K 26/0648
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
064by means of optical elements, e.g. lenses, mirrors or prisms
0648comprising lenses
Applicants
  • 华南理工大学 SOUTH CHINA UNIVERSITY OF TECHNOLOGY [CN]/[CN]
Inventors
  • 张宪民 ZHANG, Xianmin
  • 单译琳 SHAN, Yilin
  • 李凯 LI, Kai
  • 汤传刚 TANG, Chuangang
Agents
  • 广州市华学知识产权代理有限公司 GUANGZHOU HUAXUE INTELLECTUAL PROPERTY AGENCY CO., LTD.
Priority Data
201910007552.804.01.2019CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) SOLDER PASTE LASER-INDUCED FORWARD TRANSFER DEVICE AND METHOD
(FR) DISPOSITIF ET PROCÉDÉ DE TRANSFERT VERS L'AVANT INDUIT PAR LASER À PÂTE À SOUDER
(ZH) 一种锡膏激光诱导前向转移设备与方法
Abstract
(EN)
A solder paste laser-induced forward transfer device and method. The device comprises a laser (1), a beam shaping module, an optical path adjustment module, a solder paste transfer module and a computer control system (14), wherein the laser is connected to the beam shaping module, followed by the optical path adjustment module; the solder paste transfer module is located below the optical path adjustment module; the beam shaping module comprises a beam expansion lens (2), an aperture (3), a flat-top beam shaper (4) and a spatial light modulator (5); the optical path adjustment module comprises a two-dimensional galvanometer (6) and an f-θ lens (7); the solder paste transfer module is composed of a transparent substrate (8), a solder paste film (9), a fixture (10), a Z-axis lifting table (11), a receiving substrate (12), and an XYZ precision moving platform (13); and the computer control system is composed of a computer and drivers of other devices. Non-contact, high-precision solder paste transfer can be achieved without a mask, which can greatly shorten the production cycle and reduce production costs.
(FR)
La présente invention concerne un dispositif et un procédé de transfert vers l'avant induit par laser à pâte à souder. Le dispositif comprend un laser (1), un module de mise en forme de faisceau, un module de réglage de trajet optique, un module de transfert de pâte à souder et un système de commande d'ordinateur (14), le laser étant relié au module de mise en forme de faisceau, suivi par le module de réglage de trajet optique ; le module de transfert de pâte à souder étant situé en dessous du module de réglage de trajet optique ; le module de mise en forme de faisceau comprenant une lentille d'expansion de faisceau (2), une ouverture (3), un dispositif de mise en forme de faisceau à partie supérieure plate (4) et un modulateur spatial de lumière (5) ; le module de réglage de trajet optique comprenant un galvanomètre bidimensionnel (6) et une lentille f-θ (7) ; le module de transfert de pâte à souder étant composé d'un substrat transparent (8), d'un film de pâte à souder (9), d'un dispositif de fixation (10), d'une table de levage d'axe Z (11), d'un substrat de réception (12) et d'une plate-forme mobile de précision XYZ (13) ; et le système de commande d'ordinateur étant composé d'un ordinateur et de pilotes d'autres dispositifs. Un transfert de pâte à souder de haute précision sans contact peut être obtenu sans masque, ce qui peut raccourcir considérablement le cycle de production et réduire les coûts de production.
(ZH)
一种锡膏激光诱导前向转移设备与方法,包括激光器(1)、光束整形模块、光路调节模块、锡膏转移模块以及计算机控制系统(14),激光器与光束整形模块相连接,紧接着光路调节模块,而锡膏转移模块位于光路调节模块的下方。光束整形模块包括扩束透镜(2)、光圈(3)、平顶光束整形器(4)以及空间光调制器(5)。光路调节模块包括二维振镜(6)和f-θ透镜(7)。锡膏转移模块由透明基片(8)、锡膏薄膜(9)、夹具(10)、Z轴升降台(11)、接收基片(12)、XYZ精密移动平台(13)组成。计算机控制系统由计算机和其他设备的驱动器组成。可以实现无需掩模、非接触式的高精度锡膏转移,能大大缩短生产周期,降低生产成本。
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