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1. WO2020139567 - HIGH TEMPERATURE RADIO FREQUENCY IDENTIFICATION (RFID) TAG

Publication Number WO/2020/139567
Publication Date 02.07.2020
International Application No. PCT/US2019/065893
International Filing Date 12.12.2019
Chapter 2 Demand Filed 26.10.2020
IPC
G06K 19/077 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
CPC
G06K 19/0723
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
0723the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
G06K 19/0773
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
0772Physical layout of the record carrier
0773the record carrier comprising means to protect itself against external heat sources
G06K 19/083
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
08using markings of different kinds ; or more than one marking of the same kind; in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means
083Constructional details
Applicants
  • TECHNOLOGIES ROI LLC [US]/[US]
Inventors
  • KING, Patrick, F.
  • ADAMS, William
Agents
  • DAVENPORT, Taylor, M.
Priority Data
16/705,72606.12.2019US
62/785,85528.12.2018US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) HIGH TEMPERATURE RADIO FREQUENCY IDENTIFICATION (RFID) TAG
(FR) ÉTIQUETTE D'IDENTIFICATION PAR RADIOFRÉQUENCE (RFID) À HAUTE TEMPÉRATURE
Abstract
(EN)
High temperature radio frequency identification (RFID) tags are formed from nesting insulative ceramic structures with a woven cladding provided around an RFID tag. Additional interstitial woven cladding may be positioned between the ceramic structures. The layered approach provides sufficient insulation that allows sustained operation at temperatures above 500-600 degrees centigrade (500-600°C) while being sufficiently transparent to radio frequency (RF) signals to allow interrogation and response for track and trace purposes even at such elevated temperatures.
(FR)
L'invention concerne des étiquettes d'identification par radiofréquence (RFID) à haute température qui sont formées à partir de structures céramiques isolantes à emboîtement avec une gaine tissée disposée autour d'une étiquette RFID. Une gaine tissée interstitielle supplémentaire peut être placée entre les structures en céramique. L'approche en couches fournit une isolation suffisante qui permet un fonctionnement prolongé à des températures supérieures à 500-600 degrés Celsius (500-600 °C) tout en étant suffisamment transparente pour permettre l'interrogation et la réponse à des fins de suivi et de traçabilité même à de telles températures élevées.
Also published as
Latest bibliographic data on file with the International Bureau