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1. WO2020138632 - NON-CONDUCTIVE ADHESIVE FILM FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD USING SAME

Publication Number WO/2020/138632
Publication Date 02.07.2020
International Application No. PCT/KR2019/010782
International Filing Date 23.08.2019
IPC
C09J 7/20 2018.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
20characterised by their carriers
C09J 163/00 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
163Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
C09J 11/06 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
06organic
C09J 11/04 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
04inorganic
H01L 21/56 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56Encapsulations, e.g. encapsulating layers, coatings
H01L 23/482 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
482consisting of lead-in layers inseparably applied to the semiconductor body
CPC
C09J 11/04
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
02Non-macromolecular additives
04inorganic
C09J 11/06
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
02Non-macromolecular additives
06organic
C09J 163/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
163Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
C09J 2203/326
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2203Applications of adhesives in processes or use of adhesives in the form of films or foils
326for bonding electronic components such as wafers, chips or semiconductors
C09J 2301/312
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2301Additional features of adhesives in the form of films or foils
30characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
312parameters being the characterizing feature
C09J 7/20
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
7Adhesives in the form of films or foils
20characterised by their carriers
Applicants
  • 주식회사 두산 DOOSAN CORPORATION [KR]/[KR]
Inventors
  • 최태진 CHOI, Taejin
  • 김우정 KIM, Woojeong
Agents
  • 특허법인 위더피플 WE THE PEOPLE IP & LAW FIRM
Priority Data
10-2018-017063427.12.2018KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) NON-CONDUCTIVE ADHESIVE FILM FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD USING SAME
(FR) FILM ADHÉSIF NON CONDUCTEUR POUR BOÎTIER DE SEMI-CONDUCTEUR ET PROCÉDÉ DE FABRICATION DE BOÎTIER DE SEMI-CONDUCTEUR L'UTILISANT
(KO) 반도체 패키지용 비전도성 접착필름 및 이를 이용하는 반도체 패키지의 제조방법
Abstract
(EN)
The present invention relates to a non-conductive adhesive film for a semiconductor package and a semiconductor package manufacturing method using same. The non-conductive adhesive film for a semiconductor package comprises: a substrate; and an adhesive layer placed on one surface of the substrate and having a tensile modulus of 2 to 4 GPa at 25℃.
(FR)
La présente invention concerne un film adhésif non conducteur pour un boîtier de semi-conducteur et un procédé de fabrication de boîtier de semi-conducteur l'utilisant. Le film adhésif non conducteur pour un boîtier de semi-conducteur comprend : un substrat ; et une couche adhésive placée sur une surface du substrat et ayant un module de traction de 2 à 4 GPa à 25 °C.
(KO)
본 발명은 반도체 패키지용 비전도성 접착필름 및 이를 이용하는 반도체 패키지의 제조방법에 관한 것으로서, 상기 반도체 패키지용 비전도성 접착필름은 기재; 및 상기 기재의 일면에 배치되고, 25 ℃에서의 저장 탄성률(tensile modulus)이 2 내지 4 GPa인 접착층을 포함한다.
Also published as
Latest bibliographic data on file with the International Bureau