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1. WO2020138410 - CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING SAME

Publication Number WO/2020/138410
Publication Date 02.07.2020
International Application No. PCT/JP2019/051393
International Filing Date 27.12.2019
IPC
C08L 83/07 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
07containing silicon bound to unsaturated aliphatic groups
B32B 27/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products essentially comprising synthetic resin
C08K 3/01 2018.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
01characterised by their specific function
C08K 5/14 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
04Oxygen-containing compounds
14Peroxides
C08L 83/05 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
05containing silicon bound to hydrogen
H01L 21/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56Encapsulations, e.g. encapsulating layers, coatings
CPC
B32B 27/00
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
27Layered products comprising ; a layer of; synthetic resin
C08K 3/01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
01characterized by their specific function
C08K 5/14
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
04Oxygen-containing compounds
14Peroxides
H01L 21/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
H01L 23/29
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
29characterised by the material ; , e.g. carbon
H01L 23/31
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
Applicants
  • ダウ・東レ株式会社 DOW TORAY CO., LTD. [JP]/[JP]
Inventors
  • 山崎 亮介 YAMAZAKI Ryosuke
Priority Data
2018-24566027.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING SAME
(FR) COMPOSITION DE SILICONE DURCISSABLE, ARTICLE DURCI ASSOCIÉ, ET PROCÉDÉ DE FABRICATION DE CETTE COMPOSITION
(JA) 硬化性シリコーン組成物、その硬化物、およびその製造方法
Abstract
(EN)
[Problem] To provide a curable granular silicone composition which has hot-melt properties, and which provides a cured product having: excellent handling workability and curing properties in overmolding, etc.; excellent flexibility and stress relaxation properties, even when a relatively large amount of filler is added; and a relatively low coefficient of thermal expansion. [Solution] Provided are a curable granular silicone composition and a use thereof, the composition comprising: an organopolysiloxane resin containing a siloxane unit represented by SiO4/2 in an amount of at least 20 mol% with respect to the total siloxane units; and at least one functional filler, wherein the content of the vinyl (CH2=CH-) group portion of a curing-reactive functional group containing a carbon-carbon double bond is 0.05-1.50 mol% per 100 g of the silicone component in the composition, and the composition has hot-melt properties as a whole.
(FR)
L'invention fournit une composition de silicone particulaire durcissable, ou similaire, qui présente des propriétés thermofusibles, qui est particulièrement excellente en termes de flexibilité et d'endurance à de hautes températures allant de la température ambiante à 150°C d'un article durci de moulage type surmoulage, ou similaire, et est peu susceptible de provoquer un gauchissement ou un endommagement y compris en cas de moulage d'un seul tenant avec une grille de connexion en aluminium, ou similaire. Plus précisément, l'invention concerne une composition de silicone durcissable ainsi que son application. Laquelle composition de silicone durcissable comprend une résine d'organopolysiloxane comprenant 20% en moles ou plus d'une unité siloxane représentée par SiO4/2 au moins de l'ensemble des unités siloxane, et au moins une sorte de charge fonctionnelle, présente une teneur en partie base vinyl (CH2=CH-) comprise entre 0.05 et 1.50% en moles dans un groupe fonctionnel réactif au durcissement contenant une double liaison carbone-carbone pour 100g d'un composant silicone contenu dans la composition, et est dotée de propriétés thermofusibles dans son ensemble.
(JA)
[課題]ホットメルト性を有し、オーバーモールド成型等の取扱い作業性および硬化特性に優れると共に、比較的大量のフィラーを配合した場合であっても、硬化物の柔軟性と応力緩和性に優れ、かつ、熱膨張率の比較的小さい硬化物を与える硬化性粒状シリコーン組成物等を提供する。 [解決手段]SiO4/2で表されるシロキサン単位を全シロキサン単位の少なくとも20モル%以上含有するオルガノポリシロキサン樹脂、および1種類以上の機能性フィラーを含有してなり、組成物中のシリコーン成分100gあたりの炭素-炭素二重結合を含む硬化反応性の官能基中のビニル(CH2=CH-)基部分の含有量が0.05~1.50モル%であり、組成物全体としてホットメルト性を有する硬化性シリコーン組成物およびその用途。
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