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1. WO2020138409 - CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING SAME

Publication Number WO/2020/138409
Publication Date 02.07.2020
International Application No. PCT/JP2019/051392
International Filing Date 27.12.2019
IPC
C08L 83/04 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
C08J 5/00 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5Manufacture of articles or shaped materials containing macromolecular substances
C08K 3/01 2018.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
01characterised by their specific function
H01L 21/56 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56Encapsulations, e.g. encapsulating layers, coatings
H01L 23/29 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
H01L 23/31 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
CPC
C08J 5/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
5Manufacture of articles or shaped materials containing macromolecular substances
C08K 3/01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
01characterized by their specific function
C08L 83/04
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
H01L 21/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
H01L 23/29
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
29characterised by the material ; , e.g. carbon
H01L 23/31
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
Applicants
  • ダウ・東レ株式会社 DOW TORAY CO., LTD. [JP]/[JP]
Inventors
  • 山崎 亮介 YAMAZAKI Ryosuke
Priority Data
2018-24565927.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING SAME
(FR) COMPOSITION DE SILICONE DURCISSABLE, ARTICLE DURCI ASSOCIÉ, ET PROCÉDÉ DE FABRICATION DE CETTE COMPOSITION
(JA) 硬化性シリコーン組成物、その硬化物、およびその製造方法
Abstract
(EN)
[Problem] To provide a curable granular silicone composition which has hot-melt properties, and which provides a cured product obtained through overmolding or the like having particularly excellent flexibility and toughness in a temperature range from room temperature to a high temperature of about 150°C, and also provides a cured product that is not easily bent or damaged even when integrally molded with an aluminum lead frame, etc. [Solution] Provided are a curable granular silicone composition and a use thereof, said composition being characterized by comprising: (A) organopolysiloxane resin fine particles having a curing-reactive functional group; (B) a functional inorganic filler; and (C) a curing agent, wherein by using said composition, a cured product is obtained which has a storage elastic modulus of 2000 MPa or less and 100 MPa or less at 25°C and 150°C, respectively, and which has a peak value of tanδ of 0.40 or more as represented by storage elastic modulus/loss elastic modulus (G'/G").
(FR)
L'invention fournit une composition de silicone particulaire durcissable, ou similaire, qui présente des propriétés thermofusibles, qui est particulièrement excellente en termes de flexibilité et d'endurance à de hautes températures allant de la température ambiante à 150°C d'un article durci de moulage type surmoulage, ou similaire, et est peu susceptible de provoquer un gauchissement ou un endommagement y compris en cas de moulage d'un seul tenant avec une grille de connexion en aluminium, ou similaire. Plus précisément, l'invention concerne une composition de silicone particulaire durcissable ainsi que son application. Laquelle composition de silicone particulaire durcissable est caractéristique en ce qu'elle comprend (A) des particules de résine d'organopolysiloxane ayant un groupe fonctionnel réactif au durcissement, (B) une charge inorganique fonctionnelle, et (C) un agent de durcissement, et en ce qu'elle fournit un article durci dont le module d'élasticité de conservation à 25°C et 150°C est respectivement inférieur ou égal à 2000MPa et inférieur ou égal à 100MPa, et la valeur pic de tanδ représentée par module d'élasticité de conservation / module d'élasticité de pertes (G'/G'') est supérieure ou égale à 0,40.
(JA)
[課題]ホットメルト性を有し、オーバーモールド成型等の硬化物の室温から150℃程度の高温における柔軟性および強靭性に特に優れ、アルミリードフレーム等と一体成型しても反りや破損を生じにくい硬化物を与える硬化性粒状シリコーン組成物等を提供する。 [解決手段](A)硬化反応性の官能基を有するオルガノポリシロキサン樹脂微粒子、(B)機能性無機フィラー、および(C)硬化剤を含有してなり、硬化により、25℃と150℃における貯蔵弾性率がそれぞれ2000MPa以下、かつ、100MPa以下であり、貯蔵弾性率/損失弾性率(G'/G'')で表されるtanδのピーク値が0.40以上である硬化物を与えることを特徴とする硬化性粒状シリコーン組成物およびその用途。
Also published as
JP2020562489
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