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1. WO2020138335 - INORGANIC POWDER FOR HEAT-DISSIPATING RESIN COMPOSITION, HEAT-DISSIPATING RESIN COMPOSITION USING SAME, AND METHODS FOR PRODUCING SAME

Publication Number WO/2020/138335
Publication Date 02.07.2020
International Application No. PCT/JP2019/051239
International Filing Date 26.12.2019
IPC
C04B 35/01 2006.01
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
35Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
01based on oxides
C08K 3/00 2018.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
C08L 101/00 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
CPC
C04B 35/01
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE
35Shaped ceramic products characterised by their composition
01based on oxide ceramics
C08K 3/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
C08L 101/00
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
Applicants
  • 住友化学株式会社 SUMITOMO CHEMICAL COMPANY, LIMITED [JP]/[JP]
Inventors
  • 中山 篤 NAKAYAMA, Atsushi
  • 竹本 克則 TAKEMOTO, Katsunori
Agents
  • 山尾 憲人 YAMAO, Norihito
Priority Data
2018-24464727.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) INORGANIC POWDER FOR HEAT-DISSIPATING RESIN COMPOSITION, HEAT-DISSIPATING RESIN COMPOSITION USING SAME, AND METHODS FOR PRODUCING SAME
(FR) POUDRE INORGANIQUE POUR COMPOSITION DE RÉSINE DE DISSIPATION DE CHALEUR, COMPOSITION DE RÉSINE DE DISSIPATION DE CHALEUR L'UTILISANT, ET PROCÉDÉS DE PRODUCTION DE CELLE-CI
(JA) 放熱性樹脂組成物用無機粉体およびそれを用いた放熱性樹脂組成物、並びにそれらの製造方法
Abstract
(EN)
Provided are an inorganic powder suitable for producing a thick heat-dissipating resin composition and a heat-dissipating resin composition using the same. An inorganic powder 10 for use in a heat-dissipating resin composition 20 includes first inorganic particles 11 having a particle size of less than 53 μm and second inorganic particles 12 having a diameter of 100 μm or more and a BET specific surface area of 2 m2/g or less, the amount of the second inorganic particles 12 being 30%-95% by mass. The heat-dissipating resin composition 20 includes a resin 30 and the inorganic powder 10, and the amount of the second inorganic particles 12 in the heat-dissipating resin composition 20 is 100 parts by weight or more per 100 parts by weight of the resin.
(FR)
L'invention concerne une poudre inorganique appropriée pour produire une composition de résine de dissipation de chaleur épaisse et une composition de résine de dissipation de chaleur l'utilisant. Une poudre inorganique 10 destinée à être utilisée dans une composition de résine de dissipation de chaleur 20 comprend des premières particules inorganiques 11 ayant une taille de particule inférieure à 53 µm et des secondes particules inorganiques 12 ayant un diamètre de 100 µm ou plus et une surface spécifique BET de 2 m2/g ou moins, la quantité des secondes particules inorganiques 12 étant de 30 % à 95 % en masse. La composition de résine de dissipation de chaleur 20 comprend une résine 30 et la poudre inorganique 10, et la quantité des secondes particules inorganiques 12 dans la composition de résine de dissipation de chaleur 20 est de 100 parties en poids ou plus pour 100 parties en poids de la résine.
(JA)
厚い放熱性樹脂組成物の製造に適した無機粉体およびそれを用いた放熱性樹脂組成物を提供する。 放熱性樹脂組成物20に使用される無機粉体10であって、粒径53μm未満の第1の無機粒子11と、BET比表面積が2m/g以下である、粒径100μm以上の第2の無機粒子12とを含み、前記第2の無機粒子12の含有量が30~95質量%である、無機粉体。また、樹脂30と、無機粉体10と、を含む放熱性樹脂組成物20であって、前記樹脂100重量部に対し、前記第2の無機粒子12を100重量部以上含む、放熱性樹脂組成物20。
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