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1. WO2020138283 - CERAMIC-COPPER COMPOSITE, CERAMIC CIRCUIT BOARD, POWER MODULE, AND METHOD FOR MANUFACTURING CERAMIC-COPPER COMPOSITE

Publication Number WO/2020/138283
Publication Date 02.07.2020
International Application No. PCT/JP2019/051108
International Filing Date 26.12.2019
IPC
B23K 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
H01L 23/12 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
H01L 23/15 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
15Ceramic or glass substrates
H01L 23/14 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
C04B 37/02 2006.01
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
37Joining burned ceramic articles with other burned ceramic articles or other articles by heating
02with metallic articles
H05K 1/09 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the metallic pattern
CPC
B23K 1/00
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
1Soldering, e.g. brazing, or unsoldering
C04B 37/02
CCHEMISTRY; METALLURGY
04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE
37Joining burned ceramic articles with other burned ceramic articles or other articles by heating
02with metallic articles
H01L 23/12
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
H01L 23/14
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
H01L 23/15
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
12Mountings, e.g. non-detachable insulating substrates
14characterised by the material or its electrical properties
15Ceramic or glass substrates
H05K 1/09
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the ; conductive, e.g. ; metallic pattern
Applicants
  • デンカ株式会社 DENKA COMPANY LIMITED [JP]/[JP]
Inventors
  • 湯浅 晃正 YUASA Akimasa
  • 中村 貴裕 NAKAMURA Takahiro
  • 西村 浩二 NISHIMURA Koji
Agents
  • 速水 進治 HAYAMI Shinji
Priority Data
2018-24817528.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CERAMIC-COPPER COMPOSITE, CERAMIC CIRCUIT BOARD, POWER MODULE, AND METHOD FOR MANUFACTURING CERAMIC-COPPER COMPOSITE
(FR) COMPOSITE CÉRAMIQUE-CUIVRE, CARTE DE CIRCUITS IMPRIMÉS EN CÉRAMIQUE, MODULE DE PUISSANCE, ET PROCÉDÉ POUR FABRIQUER UN COMPOSITE CÉRAMIQUE-CUIVRE
(JA) セラミックス-銅複合体、セラミックス回路基板、パワーモジュール及びセラミックス-銅複合体の製造方法
Abstract
(EN)
Provided is a flat ceramic-copper composite comprising: a ceramic layer; a copper layer; and a brazing material layer disposed between the ceramic layer and the copper layer, wherein specific expression (1) is satisfied in a cut surface of the copper layer cut along a plane perpendicular to the main surface of the ceramic-copper composite, where S(102)% is the area ratio occupied by copper crystals having a crystal orientation inclined at an angle of 10° or less with respect to the crystal orientation of (102) plane, S(101)% is the area ratio occupied by copper crystals having a crystal orientation inclined at an angle of 10° or less with respect to the crystal orientation of (101) plane, S(111)% is the area ratio occupied by copper crystals having a crystal orientation inclined at an angle of 10° or less with respect to the crystal orientation of (111) plane, and S(112)% is the area ratio occupied by copper crystals having a crystal orientation inclined at an angle of 10° or less with respect to the crystal orientation of (112) plane.
(FR)
L'invention concerne un composite céramique-cuivre plat, lequel composite comprend : une couche de céramique ; une couche de cuivre ; et une couche de matériau de brasage disposée entre la couche de céramique et la couche de cuivre, l'expression spécifique (1) étant satisfaite dans une surface coupée de la couche de cuivre, coupée le long d'un plan perpendiculaire à la surface principale du composite céramique-cuivre, dans laquelle S (102) % est le rapport de surface occupé par des cristaux de cuivre ayant une orientation cristalline inclinée d'un angle de 10° ou moins par rapport à l'orientation cristalline du plan (102), S (101) % est le rapport de surface occupé par des cristaux de cuivre ayant une orientation cristalline inclinée d'un angle de 10° ou moins par rapport à l'orientation cristalline du plan (101), S (111) % est le rapport de surface occupé par des cristaux de cuivre ayant une orientation cristalline inclinée d'un angle de 10° ou moins par rapport à l'orientation cristalline du plan (111), et S (112) % est le rapport de surface occupé par des cristaux de cuivre ayant une orientation cristalline inclinée d'un angle de 10° ou moins par rapport à l'orientation cristalline du plan (112).
(JA)
セラミックス層と、銅層と、セラミックス層と銅層の間に存在するろう材層とを備えた、平板状のセラミックス-銅複合体であって、セラミックス-銅複合体を、その主面に垂直な面で切断したとき、銅層の切断面において、(102)面の結晶方位からの傾きが10°以内である結晶方位を有する銅結晶が占める面積率をS(102)%、(101)面の結晶方位からの傾きが10°以内である結晶方位を有する銅結晶が占める面積率をS(101)%、(111)面の結晶方位からの傾きが10°以内である結晶方位を有する銅結晶が占める面積率をS(111)%、(112)面の結晶方位からの傾きが10°以内である結晶方位を有する銅結晶が占める面積率をS(112)%としたとき、特定の式(1)を満たす、セラミックス-銅複合体。
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