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1. WO2020138236 - CHEMICAL AMPLIFICATION POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, PHOTOSENSITIVE DRY FILM MANUFACTURING METHOD, PATTERNED RESIST FILM MANUFACTURING METHOD, MOLD-PROVIDED SUBSTRATE MANUFACTURING METHOD, AND PLATED MOLDED OBJECT MANUFACTURING METHOD

Publication Number WO/2020/138236
Publication Date 02.07.2020
International Application No. PCT/JP2019/051011
International Filing Date 25.12.2019
IPC
G03F 7/004 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/039 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
039Macromolecular compounds which are photodegradable, e.g. positive electron resists
G03F 7/20 2006.01
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
H05K 3/18 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
18using precipitation techniques to apply the conductive material
CPC
G03F 7/004
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
G03F 7/039
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004Photosensitive materials
039Macromolecular compounds which are photodegradable, e.g. positive electron resists
G03F 7/20
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
H05K 3/18
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
18using precipitation techniques to apply the conductive material
Applicants
  • 東京応化工業株式会社 TOKYO OHKA KOGYO CO., LTD. [JP]/[JP]
Inventors
  • 片山 翔太 KATAYAMA Shota
  • 海老澤 和明 EBISAWA Kazuaki
Agents
  • 正林 真之 SHOBAYASHI Masayuki
  • 林 一好 HAYASHI Kazuyoshi
Priority Data
2018-24323326.12.2018JP
2019-20106405.11.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CHEMICAL AMPLIFICATION POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE DRY FILM, PHOTOSENSITIVE DRY FILM MANUFACTURING METHOD, PATTERNED RESIST FILM MANUFACTURING METHOD, MOLD-PROVIDED SUBSTRATE MANUFACTURING METHOD, AND PLATED MOLDED OBJECT MANUFACTURING METHOD
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE DE TYPE POSITIF À AMPLIFICATION CHIMIQUE, FILM SEC PHOTOSENSIBLE, PROCÉDÉ DE FABRICATION DE FILM SEC PHOTOSENSIBLE, PROCÉDÉ DE FABRICATION DE FILM DE RÉSERVE À MOTIFS, PROCÉDÉ DE FABRICATION DE SUBSTRAT FOURNI PAR MOULE ET PROCÉDÉ DE FABRICATION D'OBJET MOULÉ PLAQUÉ
(JA) 化学増幅型ポジ型感光性樹脂組成物、感光性ドライフィルム、感光性ドライフィルムの製造方法、パターン化されたレジスト膜の製造方法、鋳型付き基板の製造方法及びめっき造形物の製造方法
Abstract
(EN)
Provided are: a chemical amplification positive type photosensitive resin composition that can be used for exposure with h rays and that has excellent plating solution resistance and crack resistance; a photosensitive dry film provided with a photosensitive resin layer comprising the chemical amplification positive type photosensitive resin composition; a photosensitive dry film manufacturing method; a patterned resist film manufacturing method using the chemical amplification positive type photosensitive resin composition; a method for manufacturing a mold-provided substrate by using the chemical amplification positive type photosensitive resin composition; and a plated molded object manufacturing method using the mold-provided substrate. This chemical amplification positive type photosensitive resin composition contains: an acid generator (A) used for producing a mold for forming a plated molded object on a substrate having a metallic surface; and a resin (B) that becomes more soluble to alkali by the effect of an acid, wherein the acid generator (A) contains an acid generator having a specific naphthalimide backbone, and the proportion of the an acrylic resin with respect to the sum of the resin (B) and resins other than the resin (B) is not less than 70 mass%.
(FR)
La présente invention concerne : une composition de résine photosensible de type positif à amplification chimique qui peut être utilisée pour une exposition à des rayons h et qui présente une excellente résistance aux solutions de placage et une excellente résistance à la fissuration ; un film sec photosensible pourvu d'une couche de résine photosensible comprenant la composition de résine photosensible de type positif à amplification chimique ; un procédé de fabrication de film sec photosensible ; un procédé de fabrication de film de réserve à motifs utilisant la composition de résine photosensible de type positif à amplification chimique ; un procédé de fabrication d'un substrat fourni par moule à l'aide de la composition de résine photosensible de type positif à amplification chimique ; et un procédé de fabrication d'objet moulé plaqué utilisant le substrat fourni par moule. Cette composition de résine photosensible de type positif à amplification chimique contient : un générateur d'acide (A) servant à produire un moule pour former un objet moulé plaqué sur un substrat ayant une surface métallique ; et une résine (B) qui devient davantage soluble aux alcalis par l'effet d'un acide, le générateur d'acide (A) contenant un générateur d'acide ayant un squelette naphtalimide spécifique, et la proportion d'une résine acrylique par rapport à la somme de la résine (B) et des résines autres que la résine (B) n'est pas inférieure à 70 % en masse.
(JA)
h線による露光に適用可能で且つめっき液耐性及びクラック耐性に優れた化学増幅型ポジ型感光性樹脂組成物と、化学増幅型ポジ型感光性樹脂組成物からなる感光性樹脂層を備える感光性ドライフィルム、感光性ドライフィルムの製造方法と、化学増幅型ポジ型感光性樹脂組成物を用いるパターン化されたレジスト膜の製造方法と、化学増幅型ポジ型感光性樹脂組成物を用いる鋳型付き基板の製造方法と、鋳型付き基板を用いるめっき造形物の製造方法を提供する。 金属表面を有する基板上にめっき造形物を形成するための鋳型を作製するために用いられ酸発生剤(A)と酸の作用によりアルカリに対する溶解性が増大する樹脂(B)とを含む化学増幅型ポジ型感光性樹脂組成物であって、酸発生剤(A)が特定のナフタルイミド骨格を有する酸発生剤を含み、樹脂(B)と樹脂(B)以外の樹脂との合計に対するアクリル樹脂の割合が70質量%以上である。
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