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1. WO2020137802 - PAD TEMPERATURE ADJUSTING DEVICE, PAD TEMPERATURE ADJUSTING METHOD, POLISHING DEVICE, AND POLISHING SYSTEM

Publication Number WO/2020/137802
Publication Date 02.07.2020
International Application No. PCT/JP2019/049832
International Filing Date 19.12.2019
IPC
B24B 37/015 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
005Control means for lapping machines or devices
015Temperature control
B24B 37/12 2012.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
11Lapping tools
12Lapping plates for working plane surfaces
B24B 49/14 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
49Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
14taking regard of the temperature during grinding
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
G05B 13/02 2006.01
GPHYSICS
05CONTROLLING; REGULATING
BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
13Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
02electric
G16Y 10/25 2020.01
GPHYSICS
16INFORMATION AND COMMUNICATION TECHNOLOGY SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
YINFORMATION AND COMMUNICATION TECHNOLOGY SPECIALLY ADAPTED FOR THE INTERNET OF THINGS
10Economic sectors
25Manufacturing
CPC
B24B 37/015
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
005Control means for lapping machines or devices
015Temperature control
B24B 37/12
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
11Lapping tools
12Lapping plates for working plane surfaces
B24B 49/14
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
49Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
14taking regard of the temperature during grinding
G05B 13/02
GPHYSICS
05CONTROLLING; REGULATING
BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
13Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
02electric
G16Y 10/25
GPHYSICS
16INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
YINFORMATION AND COMMUNICATION TECHNOLOGY SPECIALLY ADAPTED FOR THE INTERNET OF THINGS [IoT]
10Economic sectors
25Manufacturing
G16Y 20/10
GPHYSICS
16INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
YINFORMATION AND COMMUNICATION TECHNOLOGY SPECIALLY ADAPTED FOR THE INTERNET OF THINGS [IoT]
20Information sensed or collected by the things
10relating to the environment, e.g. temperature; relating to location
Applicants
  • 株式会社荏原製作所 EBARA CORPORATION [JP]/[JP]
Inventors
  • 丸山 徹 MARUYAMA, Toru
Agents
  • 廣澤 哲也 HIROSAWA, Tetsuya
  • 渡邉 勇 WATANABE, Isamu
  • 郷戸 学 GODO, Manabu
  • 金沢 充博 KANAZAWA, Mitsuhiro
Priority Data
2018-24777128.12.2018JP
2019-22804118.12.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) PAD TEMPERATURE ADJUSTING DEVICE, PAD TEMPERATURE ADJUSTING METHOD, POLISHING DEVICE, AND POLISHING SYSTEM
(FR) DISPOSITIF DE RÉGLAGE DE TEMPÉRATURE DE TAMPON, PROCÉDÉ DE RÉGLAGE DE TEMPÉRATURE DE TAMPON, DISPOSITIF DE POLISSAGE ET SYSTÈME DE POLISSAGE
(JA) パッド温度調整装置、パッド温度調整方法、研磨装置、および研磨システム
Abstract
(EN)
The present invention pertains to a pad temperature adjusting device for adjusting the surface temperature of a polishing pad. The pad temperature adjusting device (5) comprises: a pad contacting member (11); a supplying system (30) that supplies a heating liquid and a cooling liquid to the pad contacting member (11); a pad temperature measuring device (39) that measures the surface temperature of a polishing pad (3); and a controlling unit (40) that performs Proportional-Integral-Differential (PID) control on the operation amount of a first flow rate adjusting valve (42) and a second flow rate adjusting valve (56). The controlling unit (40) comprises: a storing unit (110) that stores a learned model constructed for keeping a temperature behavior curve created on the basis of the measured values from the pad temperature measuring device (39) within a designated permissible range; and a processing device (120) that inputs at least one temperature behavior parameter into the learned model and executes calculations to output modification values for the PID parameters for PID control.
(FR)
La présente invention concerne un dispositif de réglage de température de tampon destiné à régler la température de surface d'un tampon de polissage. Le dispositif de réglage de température de tampon (5) comprend : un élément de contact de tampon (11) ; un système d'alimentation (30) qui fournit un liquide de chauffage et un liquide de refroidissement à l'élément de contact de tampon (11) ; un dispositif de mesure de température de tampon (39) qui mesure la température de surface d'un tampon de polissage (3) ; et une unité de commande (40) qui réalise une commande proportionnelle-intégrale-différentielle (PID) sur le degré d'actionnement d'une première soupape de réglage de débit (42) et d'une seconde soupape de réglage de débit (56). L'unité de commande (40) comprend : une unité de stockage (110) qui stocke un modèle appris construit pour maintenir une courbe de comportement de température créée sur la base des valeurs mesurées provenant du dispositif de mesure de température de tampon (39) dans une plage admissible désignée ; et un dispositif de traitement (120) qui entre au moins un paramètre de comportement de température dans le modèle appris et exécute des calculs pour délivrer des valeurs de modification pour les paramètres PID pour une commande PID.
(JA)
本発明は、研磨パッドの表面温度を調整するためのパッド温度調整装置に関する。パッド温度調整装置(5)は、パッド接触部材(11)と、加熱液および冷却液をパッド接触部材(11)に供給する供給システム(30)と、研磨パッド(3)の表面温度を測定するパッド温度測定器(39)と、第1流量調整バルブ(42)および第2流量調整バルブ(56)の操作量をPID制御する制御部(40)と、を備える。制御部(40)は、パッド温度測定器(39)の測定値に基づいて作成される温度挙動曲線を所定の許容範囲内に維持するために構築された学習済モデルが格納された記憶部(110)と、少なくとも1つの温度挙動パラメータを学習済モデルに入力し、PID制御のPIDパラメータの変更値を出力する演算を実行する処理装置(120)と、を備える。
Also published as
Latest bibliographic data on file with the International Bureau