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1. WO2020137764 - FLUORESCENT SUBSTRATE, DISPLAY DEVICE, AND LIGHTING DEVICE

Publication Number WO/2020/137764
Publication Date 02.07.2020
International Application No. PCT/JP2019/049691
International Filing Date 18.12.2019
IPC
H01L 33/50 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
50Wavelength conversion elements
F21V 9/30 2018.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
9Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
30Elements containing photoluminescent material distinct from or spaced from the light source
H01L 33/62 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
F21Y 115/10 2016.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V124
115Light-generating elements of semiconductor light sources
10Light-emitting diodes
CPC
F21V 9/30
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
9Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
30Elements containing photoluminescent material distinct from or spaced from the light source
H01L 33/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
50Wavelength conversion elements
H01L 33/62
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
H05K 3/28
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
Applicants
  • デンカ株式会社 DENKA COMPANY LIMITED [JP]/[JP]
Inventors
  • 小西 正宏 KONISHI Masahiro
Agents
  • 速水 進治 HAYAMI Shinji
Priority Data
2018-24454627.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) FLUORESCENT SUBSTRATE, DISPLAY DEVICE, AND LIGHTING DEVICE
(FR) SUBSTRAT FLUORESCENT, DISPOSITIF D'AFFICHAGE ET DISPOSITIF D'ÉCLAIRAGE
(JA) 蛍光体基板、発光基板及び照明装置
Abstract
(EN)
A fluorescent substrate according to the present invention has a plurality of light-emitting elements mounted on one surface, and comprises: an insulation substrate; a first electrode group that is positioned on one surface of the insulation substrate and has a plurality of electrodes joined to the plurality of light-emitting elements; and a fluorescent layer that is positioned on one surface of the insulation substrate and includes a fluorescent material in which the emission peak wavelength when light emitted by the light-emitting elements is used as excitation light is in the visible light region. The insulation substrate includes a bismaleimide resin and glass cloth.
(FR)
Un substrat fluorescent selon la présente invention comporte une pluralité d'éléments électroluminescents montés sur une surface, et comprend : un substrat isolant; un premier groupe d'électrodes qui est positionné sur une surface du substrat isolant et comporte une pluralité d'électrodes reliées à la pluralité d'éléments électroluminescents; et une couche fluorescente qui est positionnée sur une surface du substrat isolant et comprend un matériau fluorescent dans lequel la longueur d'onde de pic d'émission lorsque la lumière émise par les éléments électroluminescents est utilisée comme lumière d'excitation est dans le spectre de la lumière visible. Le substrat isolant comprend une résine de bismaléimide et un tissu de verre.
(JA)
本発明の蛍光体基板は、一面に複数の発光素子が搭載される蛍光体基板であって、絶縁基板と、前記絶縁基板の一面に配置され、前記複数の発光素子に接合する複数の電極を有する第1電極群と、前記絶縁基板の一面に配置され、前記発光素子の発光を励起光としたときの発光ピーク波長が可視光領域にある蛍光体を含む蛍光体層と、を備え、前記絶縁基板は、ビスマレイミド樹脂及びガラスクロスを含んでいる。
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