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1. WO2020137726 - COPPER ALLOY PLATE, PLATING FILM-ATTACHED COPPER ALLOY PLATE, AND METHODS RESPECTIVELY FOR MANUFACTURING THESE PRODUCTS

Publication Number WO/2020/137726
Publication Date 02.07.2020
International Application No. PCT/JP2019/049547
International Filing Date 18.12.2019
IPC
C22C 9/00 2006.01
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
9Alloys based on copper
C22C 13/00 2006.01
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
13Alloys based on tin
C25D 5/10 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
10Electroplating with more than one layer of the same or of different metals
C25D 5/50 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
48After-treatment of electroplated surfaces
50by heat-treatment
C22F 1/00 2006.01
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C22F 1/08 2006.01
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS OR NON-FERROUS ALLOYS
1Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
08of copper or alloys based thereon
CPC
B23K 35/26
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22characterised by the composition or nature of the material
24Selection of soldering or welding materials proper
26with the principal constituent melting at less than 400 degrees C
C22C 13/00
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
13Alloys based on tin
C22C 9/00
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
9Alloys based on copper
C22F 1/00
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
1Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C22F 1/08
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
1Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
08of copper or alloys based thereon
C25D 5/10
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
10Electroplating with more than one layer of the same or of different metals
Applicants
  • 三菱マテリアル株式会社 MITSUBISHI MATERIALS CORPORATION [JP]/[JP]
Inventors
  • 宮嶋 直輝 MIYAJIMA, Naoki
  • 牧 一誠 MAKI, Kazunari
  • 船木 真一 FUNAKI, Shinichi
  • 久保田 賢治 KUBOTA, Kenji
Agents
  • 青山 正和 AOYAMA, Masakazu
Priority Data
2018-24343126.12.2018JP
2019-11446620.06.2019JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) COPPER ALLOY PLATE, PLATING FILM-ATTACHED COPPER ALLOY PLATE, AND METHODS RESPECTIVELY FOR MANUFACTURING THESE PRODUCTS
(FR) PLAQUE D'ALLIAGE DE CUIVRE, PLAQUE D'ALLIAGE DE CUIVRE FIXÉE À UN FILM DE PLACAGE ET PROCÉDÉS RESPECTIFS DE FABRICATION DE CES PRODUITS
(JA) 銅合金板、めっき皮膜付銅合金板及びこれらの製造方法
Abstract
(EN)
A copper alloy plate which contains, at the thickness center thereof as observed in the plate thickness direction, 0.3 to 1.2% by mass inclusive of Mg and 0.001 to 0.2% by mass inclusive of P, with the remainder made up by Cu and unavoidable impurities, wherein the copper alloy plate has such a surface layer part that the Mg concentration in the plate surface is 30% or less of the bulk Mg concentration at the thickness center and the surface layer part has a depth at which the Mg concentration is 90% of the bulk Mg concentration as observed from the plate surface, and the Mg concentration in the surface layer part increases from the plate surface toward the thickness center at a concentration gradient of 1.8 to 50% by mass/μm inclusive.
(FR)
La présente invention concerne une plaque d'alliage de cuivre qui contient, au centre de son épaisseur telle qu'observée dans le sens épaisseur de la plaque, de 0,3 à 1,2 % en masse (inclus) de Mg et de 0,001 à 0,2 % en masse inclus de P, le reste étant constitué de Cu et d'impuretés inévitables. La plaque d'alliage de cuivre comporte une partie de couche de surface telle que la concentration en Mg dans la surface de plaque est de 30 % ou moins de la concentration globale de Mg au centre de l'épaisseur, et la partie de couche de surface a une profondeur à laquelle la concentration en Mg est de 90 % de la concentration globale de Mg telle qu'observée à partir de la surface de plaque, et la concentration en Mg dans la partie de couche de surface augmente depuis la surface de plaque vers le centre de l'épaisseur suivant un gradient de concentration de 1,8 à 50 % en masse/μm (inclus).
(JA)
板厚方向の厚さ中心部において0.3質量%以上1.2質量%以下のMgと、0.001質量%以上0.2質量%以下のPとを含み、残部がCuおよび不可避不純物からなる銅合金板であって、板表面におけるMg濃度が前記厚さ中心部におけるバルクMg濃度の30%以下であり、前記板表面から前記バルクMg濃度の90%となるまでの深さを有する表層部を有し、前記表層部において前記板表面から前記厚さ中心部に向かって1.8質量%/μm以上50質量%/μm以下の濃度勾配でMg濃度が増加している。
Also published as
Latest bibliographic data on file with the International Bureau