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1. WO2020137494 - ELECTRONIC MODULE

Publication Number WO/2020/137494
Publication Date 02.07.2020
International Application No. PCT/JP2019/048109
International Filing Date 09.12.2019
IPC
H05K 7/20 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
B60R 16/02 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
60VEHICLES IN GENERAL
RVEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
16Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
02electric
CPC
B60R 16/02
BPERFORMING OPERATIONS; TRANSPORTING
60VEHICLES IN GENERAL
RVEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
16Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
02electric ; constitutive elements
H05K 7/20
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
Applicants
  • 住友電装株式会社 SUMITOMO WIRING SYSTEMS, LTD. [JP]/[JP]
Inventors
  • 小牧 和也 KOMAKI, Kazuya
Agents
  • 河野 英仁 KOHNO, Hideto
  • 河野 登夫 KOHNO, Takao
Priority Data
2018-24815228.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTRONIC MODULE
(FR) MODULE ÉLECTRONIQUE
(JA) 電子モジュール
Abstract
(EN)
This electronic module, which includes a housing case that houses a relay (10), comprises: a heat transfer sheet (12) placed on an inner surface of a bottom plate (521) of the housing case; a terminal (101) provided on one surface (102) of the relay (10) facing the bottom plate (521); and a crank part (111) to which a first flat plate part (112) electrically connected to the terminal (101) and a second flat plate part (113) in contact with the heat transfer sheet (12) are connected in a crank shape.
(FR)
L'invention concerne un module électronique, qui comprend un boîtier de logement qui loge un relais (10), et comprend : une feuille de transfert de chaleur (12) placée sur une surface interne d'une plaque inférieure (521) du boîtier de logement ; une borne (101) disposée sur une surface (102) du relais (10) faisant face à la plaque inférieure (521) ; et une partie manivelle (111) à laquelle une première partie de plaque plate (112) connectée électriquement à la borne (101) et une seconde partie de plaque plate (113) en contact avec la feuille de transfert de chaleur (12) sont reliées en forme de manivelle.
(JA)
リレー(10)を収容する収容筐体を備える電子モジュールにおいて、前記収容筐体の底板(521)の内側面に載置される伝熱シート(12)と、底板(521)と対向するリレー(10)の一面(102)に設けられた端子(101)と、端子(101)と電気的に接続される第1扁平板部(112)及び伝熱シート(12)に接触される第2扁平板部(113)がクランク状に連結されたクランク部(111)とを備える。
Also published as
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