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1. WO2020137493 - ELECTRONIC MODULE

Publication Number WO/2020/137493
Publication Date 02.07.2020
International Application No. PCT/JP2019/048105
International Filing Date 09.12.2019
IPC
H05K 7/20 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
B60R 16/02 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
60VEHICLES IN GENERAL
RVEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
16Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
02electric
H05K 7/06 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
02Arrangements of circuit components or wiring on supporting structure
06on insulating boards
CPC
B60R 16/02
BPERFORMING OPERATIONS; TRANSPORTING
60VEHICLES IN GENERAL
RVEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
16Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
02electric ; constitutive elements
H05K 7/06
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
02Arrangements of circuit components or wiring on supporting structure
06on insulating boards ; , e.g. wiring harnesses
H05K 7/20
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
Applicants
  • 住友電装株式会社 SUMITOMO WIRING SYSTEMS, LTD. [JP]/[JP]
Inventors
  • 小牧 和也 KOMAKI, Kazuya
Agents
  • 河野 英仁 KOHNO, Hideto
  • 河野 登夫 KOHNO, Takao
Priority Data
2018-24815128.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTRONIC MODULE
(FR) MODULE ÉLECTRONIQUE
(JA) 電子モジュール
Abstract
(EN)
This electronic module (100) provided with a housing case for housing a relay (10) comprises: a heat transfer sheet (12) placed on the inner surface of one wall section (521) of the housing case; a busbar (11) connected to the relay (10) and having a portion in contact with the heat transfer sheet (12); and a pressing part (13) that presses the busbar (11) against the heat transfer sheet (12).
(FR)
L'invention concerne un module électronique (100) pourvu d'un logement de réception pour loger un relais (10) qui comprend : une feuille de transfert de chaleur (12) placée sur la surface interne d'une section de paroi (521) du logement de réception ; une barre omnibus (11) reliée au relais (10) et ayant une partie en contact avec la feuille de transfert de chaleur (12) ; et une partie de pression (13) qui presse la barre omnibus (11) contre la feuille de transfert de chaleur (12).
(JA)
リレー(10)を収容する収容筐体を備える電子モジュール(100)において、前記収容筐体の一壁部(521)の内側面に載置される伝熱シート(12)と、リレー(10)に接続され、一部が伝熱シート(12)に接触されるバスバー(11)と、バスバー(11)を伝熱シート(12)に押し付ける押圧部(13)とを備える。
Also published as
Latest bibliographic data on file with the International Bureau