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1. WO2020137331 - SILVER PASTE

Publication Number WO/2020/137331
Publication Date 02.07.2020
International Application No. PCT/JP2019/046482
International Filing Date 28.11.2019
IPC
B22F 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
B22F 7/04 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
7Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting
02of composite layers
04with one or more layers not made from powder, e.g. made from solid metal
C22C 5/08 2006.01
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
5Alloys based on noble metals
06Alloys based on silver
08with copper as the next major constituent
H01B 1/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H01B 1/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
02mainly consisting of metals or alloys
H01B 1/22 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
CPC
B22F 1/00
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
1Special treatment of metallic powder, e.g. to facilitate working, to improve properties
B22F 7/04
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
7Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting ; wherein at least one part is obtained by sintering or compression
02of composite layers
04with one or more layers not made from powder, e.g. made from solid metal
C22C 5/08
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
5Alloys based on noble metals
06Alloys based on silver
08with copper as the next major constituent
H01B 1/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H01B 1/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
02mainly consisting of metals or alloys
H01B 1/22
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
Applicants
  • 昭栄化学工業株式会社 SHOEI CHEMICAL INC. [JP]/[JP]
Inventors
  • 西村 浩輔 NISHIMURA Kousuke
  • 新藤 直人 SHINDO Naoto
  • 眞島 浩 MASHIMA Hiroshi
  • 秋本 裕二 AKIMOTO Yuji
Agents
  • 特許業務法人あしたば国際特許事務所 ASHITABA INTERNATIONAL PATENT OFFICE
Priority Data
2018-24280726.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SILVER PASTE
(FR) PÂTE D'ARGENT.
(JA) 銀ペースト
Abstract
(EN)
This silver paste containing at least a silver powder, a binder resin and an organic solvent is characterized in that the silver powder satisfies all of conditions [1] to [4]: [1] in a volume-based cumulative fraction from a laser diffraction type particle size distribution measurement, when D50 represents the 50% value, the silver powder contains a first silver powder (a) having a D50 of 3.50 to 7.50 μm, and a second silver powder (b) having a D50 of 0.80 to 2.00 μm; [2] the copper content of all the silver powder is 10 to 5,000 ppm by mass; [3] the copper content of the second silver powder (b) is 80 ppm by mass or higher; [4] the first silver powder (a) does not substantially contain copper. According to the present invention, a silver paste containing a high concentration of powder and having excellent printability can be provided, thereby allowing a silver conductor film to be provided having high fill rate and film density, exhibiting high electrical conductivity, and having excellent resistance to migration.
(FR)
L'invention concerne une pâte d'argent contenant au moins une poudre d'argent, une résine liante et un solvant organique, caractérisée en ce que la poudre d'argent satisfait à toutes les conditions [1] à [4] : [1] dans une fraction cumulative à base de volume issue d'une mesure de distribution de taille de particule de type à diffraction laser, lorsque D50 représente la valeur de 50 %, la poudre d'argent contient une première poudre d'argent (a) ayant un D50 de 3,50 à 7,50 µm, et une seconde poudre d'argent (b) ayant un D50 de 0,80 à 2,00 µm; [2] la teneur en cuivre de la totalité de la poudre d'argent est de 10 à 5000 ppm en masse; [3] la teneur en cuivre de la seconde poudre d'argent (b) est de 80 ppm en masse ou plus; [4] la première poudre d'argent (a) ne contient sensiblement pas de cuivre. Selon la présente invention, une pâte d'argent ayant une concentration élevée de poudre et ayant une excellente imprimabilité peut être fournie, ce qui permet d'obtenir un film conducteur d'argent ayant un taux de remplissage élevé et une densité de film élevée, présentant une conductivité électrique élevée, et ayant une excellente résistance à la migration.
(JA)
少なくとも銀粉末、バインダ樹脂及び有機溶剤を含有する銀ペーストであって、前記銀粉末が、下記[1]~[4]:[1]レーザー回折式粒度分布測定の体積基準の積算分率における50%値をD50としたとき、D50が3.50~7.50μmである第1の銀粉(a)と、D50が0.80~2.00μmである第2の銀粉(b)を含む;[2]前記銀粉末全体の銅含有量が10~5000質量ppmである;[3]前記第2の銀粉(b)の銅含有量が80質量ppm以上である;[4]前記第1の銀粉(a)は実質的に銅を含まない;の条件をいずれも満たすこと、を特徴とする銀ペースト。 本発明によれば、粉末を高濃度に含み、且つ、印刷性に優れる銀ペーストを提供すること、及びそのことにより、充填率及び膜密度が高く、高い導電性を示し、且つ、耐マイグレーション性に優れる銀導体膜を提供することができる。
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