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1. WO2020137246 - CURABLE COMPOSITION AND ELECTRONIC DEVICE

Publication Number WO/2020/137246
Publication Date 02.07.2020
International Application No. PCT/JP2019/044990
International Filing Date 18.11.2019
IPC
H01B 3/30 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
3Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
18mainly consisting of organic substances
30plastics; resins; waxes
C08G 18/10 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
18Polymeric products of isocyanates or isothiocyanates
06with compounds having active hydrogen
08Processes
10Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
C08G 18/58 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
18Polymeric products of isocyanates or isothiocyanates
06with compounds having active hydrogen
28characterised by the compounds used containing active hydrogen
40High-molecular-weight compounds
58Epoxy resins
C08G 18/80 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
18Polymeric products of isocyanates or isothiocyanates
06with compounds having active hydrogen
70characterised by the isocyanates or isothiocyanates used
72Polyisocyanates or polyisothiocyanates
80Masked polyisocyanates
CPC
C08G 18/10
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
18Polymeric products of isocyanates or isothiocyanates
06with compounds having active hydrogen
08Processes
10Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
C08G 18/58
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
18Polymeric products of isocyanates or isothiocyanates
06with compounds having active hydrogen
28characterised by the compounds used containing active hydrogen
40High-molecular-weight compounds
58Epoxy resins
C08G 18/80
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
18Polymeric products of isocyanates or isothiocyanates
06with compounds having active hydrogen
70characterised by the isocyanates or isothiocyanates used
72Polyisocyanates or polyisothiocyanates
80Masked polyisocyanates
H01B 3/30
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
3Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
18mainly consisting of organic substances
30plastics; resins; waxes
Applicants
  • 株式会社デンソー DENSO CORPORATION [JP]/[JP]
Inventors
  • 奥平 浩之 OKUHIRA Hiroyuki
Agents
  • 特許業務法人あいち国際特許事務所 AICHI, TAKAHASHI, IWAKURA & ASSOCIATES
Priority Data
2018-24401227.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CURABLE COMPOSITION AND ELECTRONIC DEVICE
(FR) COMPOSITION DURCISSABLE ET DISPOSITIF ÉLECTRONIQUE
(JA) 硬化性組成物及び電子機器
Abstract
(EN)
This curable composition contains: a blocked isocyanate compound (PhI) which is protected by a phenolic compound (Ph) and has a plurality of isocyanate groups; and an epoxy compound (E) which has a plurality of epoxy groups. This curable composition does not contain an isocyanate scavenger that is reactive with an isocyanate group and an epoxy scavenger that is reactive with an epoxy group.
(FR)
Cette composition durcissable contient : un composé isocyanate bloc (PhI) qui est protégé par un composé phénolique (Ph) et qui a une pluralité de groupes isocyanate; et un composé époxy (E) qui a une pluralité de groupes époxy. Cette composition durcissable ne contient pas de capteur d'isocyanate qui est réactif avec un groupe isocyanate ni un piégeur d'époxy qui est réactif avec un groupe époxy.
(JA)
硬化性組成物は、フェノール類(Ph)により保護された複数のイソシアネート基を有するブロックイソシアネート化合物(PhI)と、複数のエポキシ基を有するエポキシ化合物(E)とを含んでいる。硬化性組成物には、イソシアネート基と反応し得るイソシアネート捕捉剤及びエポキシ基と反応し得るエポキシ捕捉剤が含まれていない。
Also published as
Latest bibliographic data on file with the International Bureau