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1. WO2020137086 - HEAT-CONDUCTIVE COMPOSITION AND HEAT-CONDUCTIVE SHEET EMPLOYING SAME

Publication Number WO/2020/137086
Publication Date 02.07.2020
International Application No. PCT/JP2019/040034
International Filing Date 10.10.2019
IPC
C09K 5/14 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
KMATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
5Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
08Materials not undergoing a change of physical state when used
14Solid materials, e.g. powdery or granular
C08K 3/20 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
18Oxygen-containing compounds, e.g. metal carbonyls
20Oxides; Hydroxides
C08K 3/28 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3Use of inorganic substances as compounding ingredients
28Nitrogen-containing compounds
C08L 83/05 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
05containing silicon bound to hydrogen
C08L 83/07 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
83Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Compositions of derivatives of such polymers
04Polysiloxanes
07containing silicon bound to unsaturated aliphatic groups
C08L 101/00 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
101Compositions of unspecified macromolecular compounds
CPC
C08G 77/04
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
77Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
04Polysiloxanes
C08K 2003/2227
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
18Oxygen-containing compounds, e.g. metal carbonyls
20Oxides; Hydroxides
22of metals
2227of aluminium
C08K 2003/282
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
3Use of inorganic substances as compounding ingredients
28Nitrogen-containing compounds
282Binary compounds of nitrogen with aluminium
C08K 2201/001
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
2201Specific properties of additives
001Conductive additives
C08K 2201/005
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
2201Specific properties of additives
002Physical properties
005Additives being defined by their particle size in general
C08K 2201/014
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
2201Specific properties of additives
014Additives containing two or more different additives of the same subgroup in C08K
Applicants
  • 富士高分子工業株式会社 FUJI POLYMER INDUSTRIES CO., LTD. [JP]/[JP]
Inventors
  • 鈴村克之 SUZUMURA Katsuyuki
Agents
  • 特許業務法人池内アンドパートナーズ IKEUCHI & PARTNERS
Priority Data
2018-24091125.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) HEAT-CONDUCTIVE COMPOSITION AND HEAT-CONDUCTIVE SHEET EMPLOYING SAME
(FR) COMPOSITION THERMOCONDUCTRICE ET FEUILLE THERMOCONDUCTRICE L'UTILISANT
(JA) 熱伝導組成物及びこれを用いた熱伝導性シート
Abstract
(EN)
Provided is a heat-conductive composition that contains a matrix resin, a curing catalyst, and heat-conductive particles, wherein: with respect to 100 parts by mass of the matrix resin component, the heat-conductive particles contain (a) 900 parts by mass or greater of aluminum nitride having an average particle size of 50 μm or greater, (b) 400 parts by mass or greater of aluminum nitride having an average particle size of 5 μm or smaller and (c) greater than 0 parts by mass and less than or equal to 400 parts by mass of alumina having an average particle size of 6 μm or smaller; and a cured product of the heat-conductive composition has a thermal conductivity of 12 W/m•K or greater and an ASKER C hardness of 20-75. As a result, the present invention provides: a heat-conductive composition possessing suitable hardness and high thermal conductivity for being employed in an electrical/electronic component; and a heat-conductive sheet employing the same.
(FR)
L'invention concerne une composition thermoconductrice qui contient une résine de matrice, un catalyseur de durcissement et des particules thermoconductrices, dans laquelle : pour 100 parties en masse du composant formé de la résine de matrice, les particules thermoconductrices contiennent (a) 900 parties en masse ou davantage de nitrure d'aluminium présentant une taille moyenne de particule égale ou supérieure à 50 µm, (b) 400 parties en masse ou davantage de nitrure d'aluminium présentant une taille moyenne de particule égale ou inférieure à 5 µm et (c) plus de 0 partie en masse et jusqu'à 400 parties en masse d'alumine présentant une taille moyenne de particule égale ou inférieure à 6 µm ; et un produit durci à base de la composition thermoconductrice présente une conductivité thermique égale ou supérieure à 12 W/m•K et une dureté ASKER C variant de 20 à 75. En conséquence, la présente invention concerne : une composition thermoconductrice présentant une dureté et une conductivité thermique élevée suffisantes pour être utilisée dans un composant électrique/électronique ; et une feuille thermoconductrice l'utilisant.
(JA)
マトリックス樹脂と硬化触媒と熱伝導性粒子を含む熱伝導性組成物であって、マトリックス樹脂成分100質量部に対し、前記熱伝導性粒子は、(a)平均粒子径50μm以上の窒化アルミニウム900質量部以上と、(b)平均粒子径5μm以下の窒化アルミニウム400質量部以上と、(c)平均粒子径6μm以下のアルミナ0質量部を超え400質量部以下を含み、前記熱伝導性組成物の硬化物の熱伝導率は12W/m・K以上であり、ASKER C硬度は20~75である。これにより、電気・電子部品等へ実装するのに好適な硬度と、高熱伝導性を備えた熱伝導組成物及びこれを用いた熱伝導性シートを提供する。
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