Processing

Please wait...

PATENTSCOPE will be unavailable a few hours for maintenance reason on Tuesday 27.07.2021 at 12:00 PM CEST
Settings

Settings

Goto Application

1. WO2020137025 - ELECTRONIC CONTROL DEVICE

Publication Number WO/2020/137025
Publication Date 02.07.2020
International Application No. PCT/JP2019/035789
International Filing Date 11.09.2019
IPC
H01L 21/52 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
52Mounting semiconductor bodies in containers
H01L 23/48 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
CPC
H01L 21/52
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
52Mounting semiconductor bodies in containers
H01L 23/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
Applicants
  • 日立Astemo株式会社 HITACHI ASTEMO, LTD. [JP]/[JP]
Inventors
  • 河喜多 心哉 KAWAKITA, Shinya
  • 平岡 和 HIRAOKA, Miki
  • 河合 義夫 KAWAI, Yoshio
Agents
  • 特許業務法人サンネクスト国際特許事務所 SUNNEXT INTERNATIONAL PATENT OFFICE
Priority Data
2018-24118625.12.2018JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTRONIC CONTROL DEVICE
(FR) DISPOSITIF DE COMMANDE ÉLECTRONIQUE
(JA) 電子制御装置
Abstract
(EN)
This electronic device is provided with: an electronic component; a substrate; and a joining part for joining the electronic component to the substrate. The joining part contains: a porous metal which has continuous pores; first solder which has filling parts filling the pores of the porous metal and a surface joining part provided to at least a portion of a region between the electronic component and the porous metal and/or at least a portion of a region between the substrate and the porous metal; and second solder that is thicker than the surface joining part, that is provided between the electronic component and the substrate, and that is integrated with the first solder so as to cover lateral sides of the surface joining part of the first solder.
(FR)
La présente invention concerne un dispositif électronique pourvu : d'un composant électronique; d'un substrat; et d'une partie de jonction pour relier le composant électronique au substrat. La partie de jonction contient : un métal poreux qui a des pores continus; une première brasure qui a des parties de remplissage remplissant les pores du métal poreux et une partie de jonction de surface disposée sur au moins une partie d'une région entre le composant électronique et le métal poreux et/ou au moins une partie d'une région entre le substrat et le métal poreux; et une seconde brasure qui est plus épaisse que la partie de jonction de surface, qui est disposée entre le composant électronique et le substrat, et qui est intégrée à la première soudure de façon à recouvrir des côtés latéraux de la partie de jonction de surface de la première soudure.
(JA)
電子制御装置は、電子部品と、基板と、前記電子部品と前記基板を接合する接合部とを備える。前記接合部は、連続する空孔を有する多孔質金属と、前記多孔質金属の前記空孔に充填された充填部、前記電子部品と前記多孔質金属との間の少なくとも一部の領域と、前記基板と前記多孔質金属との間の少なくとも一部の領域との少なくとも一方に設けられた表面接合部とを有する第1のはんだと、前記電子部品と前記基板間に設けられ、前記第1のはんだの前記表面接合部の側方側を覆うように第1のはんだと一体化された、前記一方の前記表面接合部より厚い第2のはんだと、を含む。
Also published as
Latest bibliographic data on file with the International Bureau