Processing

Please wait...

PATENTSCOPE will be unavailable a few hours for maintenance reason on Tuesday 27.07.2021 at 12:00 PM CEST
Settings

Settings

Goto Application

1. WO2020136624 - LASER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL

Publication Number WO/2020/136624
Publication Date 02.07.2020
International Application No. PCT/IB2019/061412
International Filing Date 27.12.2019
IPC
B23K 26/53 2014.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
50Working by transmitting the laser beam through or within the workpiece
53for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
H01L 21/02 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
B23K 101/40 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
101Articles made by soldering, welding or cutting
36Electric or electronic devices
40Semiconductor devices
B23K 103/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
103Materials to be soldered, welded or cut
B23K 26/03 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
03Observing, e.g. monitoring, the workpiece
CPC
B23K 2101/40
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
36Electric or electronic devices
40Semiconductor devices
B23K 2103/56
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
50Inorganic material, e.g. metals, not provided for in B23K2103/02B23K2103/26
56semiconducting
B23K 26/032
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
03Observing, e.g. monitoring, the workpiece
032using optical means
B23K 26/40
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
40taking account of the properties of the material involved
B23K 26/53
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
50Working by transmitting the laser beam through or within the workpiece
53for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
B28D 5/0005
BPERFORMING OPERATIONS; TRANSPORTING
28WORKING CEMENT, CLAY, OR STONE
DWORKING STONE OR STONE-LIKE MATERIALS
5Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
0005by breaking, e.g. dicing
Applicants
  • CREE, INC. [US]/[US]
Inventors
  • DONOFRIO, Matthew
  • EDMOND, John
  • GOLAKIA, Harshad
  • MAYER, Eric
Agents
  • GUSTAFSON, Vincent K.
Priority Data
16/274,06412.02.2019US
16/410,48713.05.2019US
62/786,33329.12.2018US
62/803,34008.02.2019US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) LASER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL
(FR) PROCÉDÉ ASSISTÉ PAR LASER DE SÉPARATION DE MATÉRIAU CRISTALLIN
Abstract
(EN)
A crystalline material processing method includes forming subsurface laser damage at a first average depth position to form cracks in the substrate interior propagating outward from at least one subsurface laser damage pattern, followed by imaging the substrate top surface, analyzing the image to identify a condition indicative of presence of uncracked regions within the substrate, and taking one or more actions responsive to the analyzing. One action includes changing an instruction set for producing subsequent laser damage formation (at second or subsequent average depth positions), without necessarily forming additional damage at the first depth position. Another action includes forming additional subsurface laser damage at the first depth position. The substrate surface is illuminated with a diffuse light source arranged perpendicular to a primary substrate flat and positioned to a first side of the substrate, and imaged with an imaging device positioned to an opposing second side of the substrate.
(FR)
L'invention concerne un procédé de traitement de matériau cristallin consistant à former une détérioration par laser de sous-surface à une première position de profondeur moyenne pour former des fissures à l'intérieur d'un substrat se propageant vers l'extérieur à partir d'au moins un motif de détérioration par laser de sous-surface, puis à former une image de la surface supérieure du substrat, à analyser l'image pour identifier un état indiquant la présence de régions non fissurées à l'intérieur du substrat, et à entreprendre une ou plusieurs actions en réponse à l'analyse. Une action consiste à modifier un ensemble d'instructions pour produire une formation ultérieure de détérioration par laser (à des secondes positions de profondeur moyenne ou suivantes), sans nécessairement former de détérioration supplémentaire au niveau de la première position de profondeur. Une autre action consiste à former une détérioration par laser de sous-surface supplémentaire au niveau de la première position de profondeur. La surface de substrat est éclairée par une source de lumière diffuse disposée perpendiculairement à un substrat primaire plat et positionnée d'un premier côté du substrat, et fait l'objet d'une formation d'image au moyen d'un dispositif de formation d'image positionné d'un second côté opposé du substrat.
Latest bibliographic data on file with the International Bureau