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1. WO2020136328 - ELECTRONIC BOARD AND ASSOCIATED MANUFACTURING METHOD

Publication Number WO/2020/136328
Publication Date 02.07.2020
International Application No. PCT/FR2019/053168
International Filing Date 18.12.2019
IPC
H05K 1/18 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
H05K 3/40 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
H05K 3/28 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
CPC
H05K 1/189
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
18Printed circuits structurally associated with non-printed electric components
189characterised by the use of a flexible or folded printed circuit
H05K 2201/10106
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10007Types of components
10106Light emitting diode [LED]
H05K 2201/10128
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10007Types of components
10128Display
H05K 2201/10151
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10007Types of components
10151Sensor
H05K 2201/10242
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10227Other objects, e.g. metallic pieces
10242Metallic cylinders
H05K 3/281
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
28Applying non-metallic protective coatings
281by means of a preformed insulating foil
Applicants
  • IDEMIA FRANCE [FR]/[FR]
Inventors
  • BOSQUET, Olivier
  • HUET, Mickaël
  • GAC, Philippe
  • LAVARENNE, Rémi
Agents
  • SANTARELLI
Priority Data
187416926.12.2018FR
Publication Language French (FR)
Filing Language French (FR)
Designated States
Title
(EN) ELECTRONIC BOARD AND ASSOCIATED MANUFACTURING METHOD
(FR) CARTE ELECTRONIQUE ET PROCEDE DE FABRICATION ASSOCIE
Abstract
(EN)
The present invention relates to an electronic board comprising an assembly (10) comprising at least one flexible substrate (11) and a printed circuit on the flexible substrate, referred to as FPC (11, 12), the FPC comprising at least one contact plate (12) on the surface of the substrate (11), the assembly (10) further comprising at least one contact pad (14) secured to the contact plate (12) configured to establish an electrical connection with an electronic component (25) and an electronic component connected to the contact pad. The invention also relates to a method for manufacturing such an electronic board (20).
(FR)
La présente invention concerne une carte électronique comportant un ensemble (10) comportant au moins un support flexible (11) et un circuit imprimé sur le support flexible, dit FPC (11,12), le FPC comportant au moins une plaque de contact (12) en surface du support (11), l'ensemble (10) comportant en outre au moins un plot (14) fixé sur la plaque de contact (12) configuré pour établir une connexion électrique avec un composant électronique (25) et un composant électronique connecté au plot. Elle concerne aussi un procédé de réalisation d'une telle carte électronique (20).
Also published as
Latest bibliographic data on file with the International Bureau