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1. WO2020135498 - METHOD AND APPARATUS FOR FINAL POLISHING OF SILICON WAFER

Publication Number WO/2020/135498
Publication Date 02.07.2020
International Application No. PCT/CN2019/128276
International Filing Date 25.12.2019
IPC
B24B 37/04 2012.1
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
04designed for working plane surfaces
H01L 21/304 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
CPC
B24B 1/00
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
1Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
B24B 29/02
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
29Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
02designed for particular workpieces
Applicants
  • 徐州鑫晶半导体科技有限公司 XUZHOU XINJING SEMICONDUCTOR TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 郑加镇 ZHENG, Jiazhen
Agents
  • 北京清亦华知识产权代理事务所(普通合伙) TSINGYIHUA INTELLECTUAL PROPERTY LLC
Priority Data
201811636945.729.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) METHOD AND APPARATUS FOR FINAL POLISHING OF SILICON WAFER
(FR) PROCÉDÉ ET APPAREIL POUR LE POLISSAGE FINAL D'UNE TRANCHE DE SILICIUM
(ZH) 硅晶圆的最终抛光方法和最终抛光装置
Abstract
(EN)
Provided are a method and apparatus for final polishing of a silicon wafer. The method for final polishing comprises: during final polishing to the remaining predetermined time, using both polishing slurry and an oxidizing solution as a polishing liquid to form a hydrophilic silicon oxide film on the surface of a silicon wafer.
(FR)
L'invention concerne un procédé et un appareil pour le polissage final d'une tranche de silicium. Le procédé de polissage final comprend les étapes consistant à : pendant le polissage final jusqu'au temps prédéterminé restant, utiliser à la fois une suspension de polissage et une solution oxydante comme liquide de polissage pour former un film d'oxyde de silicium hydrophile sur la surface d'une tranche de silicium.
(ZH)
提供了硅晶圆的最终抛光方法和最终抛光装置,其中,最终抛光方法包括在所述最终抛光进行至剩余预定时间内,同时使用抛光浆料和氧化溶液作为抛光液,以使得硅晶圆表面形成亲水性氧化硅薄膜。
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