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1. WO2020134590 - MEMS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

Publication Number WO/2020/134590
Publication Date 02.07.2020
International Application No. PCT/CN2019/115616
International Filing Date 05.11.2019
IPC
B81C 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
B81B 7/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems
B81B 7/02 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems
02containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
CPC
B81B 7/00
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
B81B 7/007
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
0032Packages or encapsulation
007Interconnections between the MEMS and external electrical signals
B81B 7/02
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
02containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
B81C 1/00
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
B81C 1/00301
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00261Processes for packaging MEMS devices
00301Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
Applicants
  • 中芯集成电路(宁波)有限公司上海分公司 NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH) [CN]/[CN]
Inventors
  • 秦晓珊 QIN, Xiaoshan
Agents
  • 上海思捷知识产权代理有限公司 SHANGHAI SAVVY IP AGENCY CO., LTD.
Priority Data
201811615834.827.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) MEMS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
(FR) STRUCTURE D'EMBALLAGE MEMS ET SON PROCÉDÉ DE FABRICATION
(ZH) MEMS封装结构及其制作方法
Abstract
(EN)
A MEMS package structure and a method for manufacturing same. The MEMS package structure comprises a MEMS chip (200) and a device wafer (100). The MEMS chip (200) has micro-cavities (211, 221), and contact pads (212, 222) for connection to external electrical signals. The micro-cavity (221) of the MEMS chip (200) is provided with an opening (221a) in communication with the outside. The device wafer (100) is provided therein with a control unit corresponding to the MEMS chip (200). An interconnection structure (300) is provided in the device wafer (100) and is electrically connected to both the contact pads (212, 222) and the control unit. A rewiring layer (400) electrically connected to the interconnection structure (300) is provided on a second surface of the device wafer (100). The provision of the MEMS chip (200) and the rewiring layer (400) respectively on both sides of the device wafer is conductive to reducing the size of the MEMS package structure; various MEMS chips can be integrated on one device wafer, thereby meeting the requirements for the function integration capability of the MEMS package structure in practical application.
(FR)
La présente invention concerne un structure d'emballage MEMS et son procédé de fabrication. La structure d'emballage MEMS comprend une puce MEMS (200) et une tranche de dispositif (100). La puce MEMS (200) comporte des micro-cavités (211, 221) et des plots de contact (212, 222) pour la connexion à des signaux électriques externes. La micro-cavité (221) de la puce MEMS (200) est pourvue d'une ouverture (221a) en communication avec l'extérieur. La tranche de dispositif (100) est pourvue d'une unité de commande correspondant à la puce MEMS (200). Une structure d'interconnexion (300) est disposée dans la tranche de dispositif (100) et est électriquement connectée à la fois aux plots de contact (212, 222) et à l'unité de commande. Une couche de recâblage (400) électriquement connectée à la structure d'interconnexion (300) est disposée sur une seconde surface de la tranche de dispositif (100). La fourniture de la puce MEMS (200) et de la couche de recâblage (400) respectivement des deux côtés de la tranche de dispositif conduit à une réduction de la taille de la structure d'emballage MEMS ; diverses puces MEMS peuvent être intégrées sur une tranche de dispositif, répondant ainsi aux exigences de capacité d'intégration de fonction de la structure d'emballage MEMS dans une application pratique.
(ZH)
一种MEMS封装结构及其制作方法。其中MEMS封装结构包括MEMS芯片(200)及器件晶圆(100),MEMS芯片(200)具有微腔(211、221)和用于连接外部电信号的接触垫(212、222), MEMS芯片(200)的微腔(221)具有与外部连通的开口(221a),器件晶圆(100)中设置有与MEMS芯片(200)对应的控制单元,互连结构(300)设置于器件晶圆(100)中并与接触垫(212、222)和控制单元均电连接,在器件晶圆(100)的第二表面设置有与互连结构(300)电连接的再布线层(400)。通过将MEMS芯片(200)和再布线层(400)分别设置在器件晶圆的两侧,有利于缩小MEMS封装结构的尺寸,同一器件晶圆上可集成多种MEMS芯片,有利于满足实际应用中对MEMS封装结构的功能集成能力的要求。
Also published as
KR1020217014346
Latest bibliographic data on file with the International Bureau