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1. WO2020134353 - SPEAKER MODULE

Publication Number WO/2020/134353
Publication Date 02.07.2020
International Application No. PCT/CN2019/110718
International Filing Date 12.10.2019
IPC
H04R 9/06 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
9Transducers of moving-coil, moving-strip, or moving-wire type
06Loudspeakers
H04R 9/02 2006.01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
9Transducers of moving-coil, moving-strip, or moving-wire type
02Details
CPC
H04R 1/025
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1Details of transducers, ; loudspeakers or microphones
02Casings; Cabinets ; ; Supports therefor;; Mountings therein
025Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
H04R 1/026
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1Details of transducers, ; loudspeakers or microphones
02Casings; Cabinets ; ; Supports therefor;; Mountings therein
026Supports for loudspeaker casings
H04R 2499/11
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
2499Aspects covered by H04R or H04S not otherwise provided for in their subgroups
10General applications
11Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
H04R 31/006
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
31Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
006Interconnection of transducer parts
H04R 7/04
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
7Diaphragms for electromechanical transducers
02characterised by the construction
04Plane diaphragms
Applicants
  • 瑞声声学科技(深圳)有限公司 AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. [CN]/[CN]
  • 瑞声科技(新加坡)有限公司 AAC TECHNOLOGIES PTE. LTD. [SG]/[SG]
Inventors
  • 冯炉 FENG, Lu
Agents
  • 深圳市恒申知识产权事务所(普通合伙) HENSEN INTELLECTUAL PROPERTY FIRM
Priority Data
201811631125.929.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) SPEAKER MODULE
(FR) MODULE DE HAUT-PARLEUR
(ZH) 扬声器模组
Abstract
(EN)
Disclosed is a speaker module. The speaker module comprises a housing, a speaker unit provided with a working pad, and a cover body, wherein the cover body cooperates with the housing to enclose an accommodation space to accommodate the speaker unit; the cover body comprises conductive portions; the conductive portions are formed on the cover body; a conductive pin is formed on one side of each of the conductive portions, and a conductive terminal is formed on the other side thereof; the conductive pin is electrically connected to the working pad of the speaker unit; and the conductive terminal is correspondingly electrically connected to an external circuit. According to the present invention, by replacing a flexible printed circuit board with the conductive pin, the structure is simplified, the product reliability is improved, and a space of a rear cavity is economized.
(FR)
L'invention concerne un module de haut-parleur. Le module de haut-parleur comprend un boîtier, une unité de haut-parleur pourvue d'un plot de fonctionnement, et un corps de couvercle, le corps de couvercle coopérant avec le boîtier pour enfermer un espace de réception afin de recevoir l'unité de haut-parleur ; le corps de couvercle comprend des parties conductrices ; les parties conductrices sont formées sur le corps de couvercle ; une broche conductrice est formée sur un côté de chacune des parties conductrices, et une borne conductrice est formée sur l'autre côté de celle-ci ; la broche conductrice est électriquement connectée au tampon de travail de l'unité de haut-parleur ; et la borne conductrice est connectée électriquement de manière correspondante à un circuit externe. Selon la présente invention, en remplaçant une carte de circuit imprimé souple avec la broche conductrice, la structure est simplifiée, la fiabilité du produit est améliorée, et un espace d'une cavité arrière est économisé.
(ZH)
本发明公开一种扬声器模组。所述扬声器模组包括壳体、具工作焊盘的扬声器单体及盖体,所述盖体配合所述壳体围成收容空间收容所述扬声器单体,所述盖体包括导电部,所述导电部成型于所述盖体,所述导电部一侧形成导电引脚,另一侧形成导电端子,所述导电引脚与所述扬声器单体的工作焊盘电连接,所述导电端子与外部电路对应电连接。本发明通过导电引脚取代柔性印刷电路板,简化结构,提高产品可靠度和节约后腔空间。
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