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1. WO2020134315 - LOUDSPEAKER STRUCTURE, MOBILE DEVICE, AND METHOD FOR ASSEMBLING LOUDSPEAKER STRUCTURE

Publication Number WO/2020/134315
Publication Date 02.07.2020
International Application No. PCT/CN2019/110102
International Filing Date 09.10.2019
IPC
H04R 9/02 2006.1
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
9Transducers of moving-coil, moving-strip, or moving-wire type
02Details
H04R 9/06 2006.1
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
9Transducers of moving-coil, moving-strip, or moving-wire type
06Loudspeakers
CPC
H04R 1/021
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1Details of transducers, ; loudspeakers or microphones
02Casings; Cabinets ; ; Supports therefor;; Mountings therein
021incorporating only one transducer
H04R 1/025
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1Details of transducers, ; loudspeakers or microphones
02Casings; Cabinets ; ; Supports therefor;; Mountings therein
025Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
H04R 1/2803
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1Details of transducers, ; loudspeakers or microphones
20Arrangements for obtaining desired frequency or directional characteristics
22for obtaining desired frequency characteristic only
28Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
2803for loudspeaker transducers
H04R 1/288
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
1Details of transducers, ; loudspeakers or microphones
20Arrangements for obtaining desired frequency or directional characteristics
22for obtaining desired frequency characteristic only
28Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
2869Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
2876by means of damping material, e.g. as cladding
288for loudspeaker transducers
H04R 2400/11
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
2400Loudspeakers
11Aspects regarding the frame of loudspeaker transducers
H04R 2499/11
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
2499Aspects covered by H04R or H04S not otherwise provided for in their subgroups
10General applications
11Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
Applicants
  • 瑞声声学科技(深圳)有限公司 AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. [CN]/[CN]
  • 瑞声科技(新加坡)有限公司 AAC TECHNOLOGIES PTE. LTD. [SG]/[SG]
Inventors
  • 王程良 WANG, Chengliang
Agents
  • 深圳市恒申知识产权事务所(普通合伙) HENSEN INTELLECTUAL PROPERTY FIRM
Priority Data
201811613758.727.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) LOUDSPEAKER STRUCTURE, MOBILE DEVICE, AND METHOD FOR ASSEMBLING LOUDSPEAKER STRUCTURE
(FR) STRUCTURE DE HAUT-PARLEUR, DISPOSITIF MOBILE ET PROCÉDÉ D'ASSEMBLAGE D'UNE STRUCTURE DE HAUT-PARLEUR
(ZH) 一种扬声器结构、移动设备及扬声器结构的组装方法
Abstract
(EN)
The present invention provides a loudspeaker structure, a mobile device, and a method for assembling a loudspeaker structure. The mobile device comprises the loudspeaker structure. The loudspeaker structure comprises: a first cover plate, a second cover plate, a package ring, and a loudspeaker unit. The loudspeaker unit is assembled on the first cover plate. The second cover plate covers the first cover plate. An assembling port is provided on the second cover plate. The package ring is embedded and assembled within the assembling port. The package ring is sleeved on the loudspeaker unit. The package ring, the first cover plate, and the second cover plate jointly enclose to form a rear cavity. The rear cavity is filled with a Dbass material. The rear cavity surrounds the loudspeaker unit. The peripheral wall of the package ring is provided with through holes. The through holes communicate the rear cavity with the loudspeaker unit. The package ring comprises a mesh plate. The mesh plate is provided on the peripheral wall of the package ring and covers the through holes. The loudspeaker structure of the solution is not limited by mold forming requirements, facilitates large-scale applications, and features low costs.
(FR)
La présente invention concerne une structure de haut-parleur, un dispositif mobile et un procédé d'assemblage de structure de haut-parleur. Le dispositif mobile comprend la structure de haut-parleur. La structure de haut-parleur comprend : une première plaque de couverture, une seconde plaque de couverture, un anneau de boîtier et une unité de haut-parleur. L'unité de haut-parleur est assemblée sur la première plaque de couverture. La seconde plaque de couverture recouvre la première plaque de couverture. Un orifice d'assemblage est disposé sur la seconde plaque de couverture. L'anneau de boîtier est incorporé et assemblé à l'intérieur de l'orifice d'assemblage. L'anneau de boîtier est emmanché sur l'unité de haut-parleur. L'anneau de boîtier, la première plaque de couverture et la seconde plaque de couverture forment conjointement une cavité arrière. La cavité arrière est remplie d'un matériau Dbass. La cavité arrière entoure l'unité haut-parleur. La paroi périphérique de l'anneau de boîtier est pourvue de trous traversants. Les trous traversants font communiquer la cavité arrière avec l'unité de haut-parleur. L'anneau de boîtier comprend une plaque de mailles. La plaque de mailles est disposée sur la paroi périphérique de l'anneau de boîtier et recouvre les trous traversants. La structure de haut-parleur de la solution n'est pas limitée par des exigences de formation de moule, facilite des applications à grande échelle, et présente de faibles coûts.
(ZH)
本发明提供了一种扬声器结构、移动设备及扬声器结构的组装方法,移动设备内包括扬声器结构,其中,扬声器结构包括:第一盖板、第二盖板、封装环和扬声器单体,扬声器单体装配在第一盖板上,第二盖板盖合在第一盖板上,第二盖板上开设有装配口,封装环卡嵌装配在装配口内,封装环套设在扬声器单体外,封装环、第一盖板和第二盖板共同围合成后腔,后腔内填充Dbass材料,后腔包绕扬声器单体,封装环的周壁上开设有通孔,通孔将后腔和扬声器单体连通,封装环包括网板,网板设置在封装环的周壁上并将通孔覆盖。本方案的扬声器结构不受模具成型要求的限制,便于大规模应用,成本较低。
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Latest bibliographic data on file with the International Bureau