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1. WO2020134301 - CIRCUIT BOARD, MANUFACTURING METHOD AND ELECTRONIC DEVICE

Publication Number WO/2020/134301
Publication Date 02.07.2020
International Application No. PCT/CN2019/109555
International Filing Date 30.09.2019
IPC
H05K 1/02 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
G02B 6/12 2006.01
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
10of the optical waveguide type
12of the integrated circuit kind
CPC
G02B 6/12
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
10of the optical waveguide type
12of the integrated circuit kind
H05K 1/02
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 1/0231
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0213Electrical arrangements not otherwise provided for
0216Reduction of cross-talk, noise or electromagnetic interference
023using auxiliary mounted passive components or auxiliary substances
0231Capacitors or dielectric substances
H05K 1/0274
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0274Optical details, e.g. printed circuits comprising integral optical means
H05K 1/16
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
16incorporating printed electric components, e.g. printed resistor, capacitor, inductor
H05K 1/162
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
16incorporating printed electric components, e.g. printed resistor, capacitor, inductor
162incorporating printed capacitors
Applicants
  • 中兴通讯股份有限公司 ZTE CORPORATION [CN]/[CN]
Inventors
  • 陈肖琳 CHEN, Xiaolin
  • 朱顺临 ZHU, Shunlin
  • 田昊 TIAN, Hao
  • 王迎新 WANG, Yingxin
  • 任永会 REN, Yonghui
Agents
  • 北京康信知识产权代理有限责任公司 KANGXIN PARTNERS, P.C.
Priority Data
201811616137.427.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) CIRCUIT BOARD, MANUFACTURING METHOD AND ELECTRONIC DEVICE
(FR) CARTE DE CIRCUIT IMPRIMÉ, PROCÉDÉ DE FABRICATION ET DISPOSITIF ÉLECTRONIQUE
(ZH) 一种电路板、制备方法及电子装置
Abstract
(EN)
A circuit board, a manufacturing method and an electronic device. The circuit board at least comprises a first base layer (1). A first planar capacitor set (2) and an optical waveguide (3) are provided within a region at a first side of the first base layer (1). The first planar capacitor set (2) comprises at least a pair of planar capacitors. The first planar capacitor set (2) and the optical waveguide (3) are arranged side by side in a direction parallel to a plane in which the first base layer (1) is located. The invention solves the problem in the art in which an optical electronic printed circuit board does not effectively filter power source noise in a high frequency band, thereby enhancing power source stability of an optical electronic printed circuit board.
(FR)
La présente invention concerne une carte de circuit imprimé, une procédé de fabrication et un dispositif électronique. La carte de circuit imprimé comprend au moins une première couche de base (1). Un premier ensemble de condensateurs planaires (2) et un guide d'ondes optique (3) sont disposés à l'intérieur d'une région sur un premier côté de la première couche de base (1). Le premier ensemble de condensateurs planaires (2) comprend au moins une paire de condensateurs planaires. Le premier ensemble de condensateurs planaires (2) et le guide d'ondes optique (3) sont disposés côte à côte dans une direction parallèle à un plan dans lequel la première couche de base (1) est située. L'invention résout le problème de l'état de la technique dans lequel une carte de circuit imprimé électronique optique ne filtre pas efficacement le bruit de source d'alimentation dans une bande haute fréquence, améliorant ainsi la stabilité de source d'alimentation d'une carte de circuit imprimé électronique optique.
(ZH)
一种电路板、制备方法及电子装置,电路板至少包括一个第一基层(1),其中,在第一基层(1)的第一侧的区域内设有第一平面电容组(2)和光波导(3),其中,第一平面电容组(2)中包括至少一对平面电容,第一平面电容组(2)与光波导(3)沿平行于第一基层(1)所在平面的方向并列设置。其解决了相关技术中光电印制电路板中的电源高频段滤波效果较差的问题,达到了提高光电印制电路板的电源稳定性的效果。
Also published as
Latest bibliographic data on file with the International Bureau