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1. WO2020134249 - PACKAGED FILM, PACKAGING METHOD FOR LIGHT-EMITTING DEVICE, AND LIGHT-EMITTING APPARATUS

Publication Number WO/2020/134249
Publication Date 02.07.2020
International Application No. PCT/CN2019/108098
International Filing Date 26.09.2019
IPC
H01L 33/54 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
54having a particular shape
CPC
H01L 33/54
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
54having a particular shape
H01L 33/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
56Materials, e.g. epoxy or silicone resin
H01L 51/52
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
H01L 51/5237
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5237Passivation; Containers; Encapsulation, e.g. against humidity
Applicants
  • TCL科技集团股份有限公司 TCL TECHNOLOGY GROUP CORPORATION [CN]/[CN]
Inventors
  • 王劲 WANG, Jin
  • 曹蔚然 CAO, Weiran
  • 钱磊 QIAN, Lei
Agents
  • 深圳中一联合知识产权代理有限公司 SHENZHEN ZHONGYI UNION INTELLECTUAL PROPERTY AGENCY CO., LTD.
Priority Data
201811635021.529.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) PACKAGED FILM, PACKAGING METHOD FOR LIGHT-EMITTING DEVICE, AND LIGHT-EMITTING APPARATUS
(FR) FILM ENCAPSULÉ, PROCÉDÉ D'ENCAPSULATION POUR DISPOSITIF ÉLECTROLUMINESCENT ET APPAREIL ÉLECTROLUMINESCENT
(ZH) 封装薄膜和发光器件的封装方法以及发光装置
Abstract
(EN)
A packaged film, a packaging method for a light-emitting device, and a light-emitting apparatus. The packaged film comprises N stacked units, and each of the stacked units consists of a barrier layer (4) and a surfactant layer (5) which are sequentially stacked; in the packaged film, the barrier layer (4) and the surfactant layer (5) are alternatively adjacent, wherein N is an integer greater than or equal to 1. The packaged film is used for packaging the light-emitting device so that the erosion for a functional layer (2) of the light-emitting device due to water and oxygen can be effectively reduced, and the service life of the light-emitting device is improved.
(FR)
L'invention concerne un film encapsulé, un procédé d'encapsulation pour un dispositif électroluminescent et un appareil électroluminescent. Le film encapsulé comprend N unités empilées, et chacune des unités empilées est constituée d'une couche barrière (4) et d'une couche de tensioactif (5) qui sont empilées séquentiellement ; dans le film encapsulé, la couche barrière (4) et la couche de tensioactif (5) sont alternativement adjacentes, N étant un nombre entier supérieur ou égal à 1. Le film encapsulé est utilisé pour encapsuler le dispositif électroluminescent de telle sorte que l'érosion d'une couche fonctionnelle (2) du dispositif électroluminescent due à l'eau et à l'oxygène peut être efficacement réduite, et la durée de vie du dispositif électroluminescent est améliorée.
(ZH)
一种封装薄膜和发光器件的封装方法以及发光装置。所述封装薄膜包括N个层叠单元,每个所述层叠单元由依次层叠设置的阻隔层(4)和表面活性剂层(5)组成,所述封装薄膜中,所述阻隔层(4)与所述表面活性剂层(5)交替相邻;其中,N为大于或等于1的整数。用该封装薄膜封装发光器件可有效地减少水氧对发光器件功能层(2)的侵蚀,提高发光器件的寿命。
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Latest bibliographic data on file with the International Bureau