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1. WO2020134083 - DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE

Publication Number WO/2020/134083
Publication Date 02.07.2020
International Application No. PCT/CN2019/098813
International Filing Date 01.08.2019
IPC
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
CPC
H01L 2227/323
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2227Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
32Devices including an organic light emitting device [OLED], e.g. OLED display
323Multistep processes for AMOLED
H01L 27/3227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3225OLED integrated with another component
3227the other component being a light sensitive element, e.g. inorganic solar cell, inorganic photodiode
H01L 27/3234
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3225OLED integrated with another component
3234the other component being an imager structure
H01L 27/3244
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
H01L 27/3276
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
3276Wiring lines
H01L 51/5206
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5203Electrodes
5206Anodes, i.e. with high work-function material
Applicants
  • 云谷(固安)科技有限公司 YUNGU (GU'AN) TECHNOLOGY CO., LTD. [CN]/[CN]
  • 昆山国显光电有限公司 KUNSHAN GO-VISIONOX OPTO-ELECTRONICS CO., LTD. [CN]/[CN]
Inventors
  • 彭兆基 PENG, ChaoChi
  • 刘明星 LIU, Mingxing
  • 甘帅燕 GAN, Shuaiyan
Agents
  • 北京曼威知识产权代理有限公司 BEIJING MAVAIP INTELLECTUAL PROPERTY LAW FIRM
Priority Data
201811627712.028.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE
(FR) PANNEAU D'AFFICHAGE ET SON PROCÉDÉ DE FABRICATION, ET DISPOSITIF D'AFFICHAGE
(ZH) 显示面板及其制备方法、显示装置
Abstract
(EN)
Provided are a display panel and a manufacturing method thereof, and a display device. The display panel has a first display region and a second display region. The display panel further comprises a substrate, a drive circuit layer, a light-emitting function film layer and an electrically-conductive layer positioned at the first display region and the second display region. The drive circuit layer is formed above the substrate. The light-emitting function film layer is formed above the drive circuit layer. The electrically-conductive layer is formed above the light-emitting function film layer. A portion of the electrically-conductive layer in the first display region has a thickness less then a thickness of a portion of the electrically-conductive layer in the second display region.
(FR)
L'invention concerne un panneau d'affichage et son procédé de fabrication, et un dispositif d'affichage. Le panneau d'affichage comprend une première région d'affichage et une seconde région d'affichage. Le panneau d'affichage comprend en outre un substrat, une couche de circuit d'attaque, une couche de film à fonction électroluminescente et une couche électriquement conductrice positionnée au niveau de la première région d'affichage et de la seconde région d'affichage. La couche de circuit d'attaque est formée au-dessus du substrat. La couche de film à fonction électroluminescente est formée au-dessus de la couche de circuit d'attaque. La couche électriquement conductrice est formée au-dessus de la couche de film à fonction électroluminescente. Une partie de la couche électriquement conductrice dans la première région d'affichage a une épaisseur inférieure à une épaisseur d'une partie de la couche électriquement conductrice dans la seconde région d'affichage.
(ZH)
本申请提供了一种显示面板及其制备方法、显示装置。所述显示面板具有第一显示区及第二显示区,所述显示面板还包括位于所述第一显示区及所述第二显示区的衬底、驱动电路层、发光功能膜层及导电层;所述驱动电路层形成于所述衬底上;所述发光功能膜层形成于所述驱动电路层上;所述导电层形成于所述发光功能膜层上,位于所述第一显示区的导电层的厚度小于位于所述第二显示区的导电层的厚度。
Also published as
Latest bibliographic data on file with the International Bureau