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1. WO2020133858 - ELECTRONIC DEVICE HOUSING, PREPARATION METHOD THEREFOR AND ELECTRONIC DEVICE

Publication Number WO/2020/133858
Publication Date 02.07.2020
International Application No. PCT/CN2019/085006
International Filing Date 29.04.2019
IPC
H05K 5/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5Casings, cabinets or drawers for electric apparatus
CPC
H05K 5/00
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5Casings, cabinets or drawers for electric apparatus
H05K 5/02
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5Casings, cabinets or drawers for electric apparatus
02Details
H05K 5/0243
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
5Casings, cabinets or drawers for electric apparatus
02Details
0217Mechanical details of casings
0243for decorative purposes
Applicants
  • 比亚迪股份有限公司 BYD COMPANY LIMITED [CN]/[CN]
Inventors
  • 马兰 MA, Lan
  • 金海燕 JIN, Haiyan
  • 陈梁 CHEN, Liang
Agents
  • 北京清亦华知识产权代理事务所(普通合伙) TSINGYIHUA INTELLECTUAL PROPERTY LLC
Priority Data
201811642127.829.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) ELECTRONIC DEVICE HOUSING, PREPARATION METHOD THEREFOR AND ELECTRONIC DEVICE
(FR) BOÎTIER DE DISPOSITIF ÉLECTRONIQUE, SON PROCÉDÉ DE PRÉPARATION ET DISPOSITIF ÉLECTRONIQUE
(ZH) 电子设备壳体及其制备方法和电子设备
Abstract
(EN)
An electronic device housing, a preparation method therefor and an electronic device. The housing comprises a bottom plate and a middle frame, wherein the middle frame is connected to the bottom plate, the material of the middle frame is plastic, and the material of the bottom plate is sapphire; otherwise, the material of the bottom plate is glass, and the material of the middle frame is sapphire. The bottom plate and the middle frame have an interface-free continuous connection therebetween.
(FR)
L'invention concerne un boîtier de dispositif électronique, son procédé de préparation et un dispositif électronique. Le boîtier comprend une plaque inférieure et un cadre intermédiaire, le cadre intermédiaire étant relié à la plaque inférieure, le matériau du cadre intermédiaire étant en plastique, et le matériau de la plaque inférieure étant du saphir; ou bien le matériau de la plaque inférieure étant du verre et le matériau du cadre intermédiaire étant du saphir. La plaque inférieure et le cadre intermédiaire présentent enter eux une connexion continue sans interface.
(ZH)
一种电子设备壳体及其制备方法和电子设备,该壳体包括底板和中框,中框与底板相连接,其中,中框的材质为玻璃,底板的材质为蓝宝石;或者,底板的材质为玻璃,中框的材质为蓝宝石;底板与中框之间具有无界面连续连接。
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Latest bibliographic data on file with the International Bureau