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1. WO2020133780 - FLEXIBLE OLED DISPLAY PANEL AND PREPARATION METHOD THEREOF

Publication Number WO/2020/133780
Publication Date 02.07.2020
International Application No. PCT/CN2019/080884
International Filing Date 01.04.2019
IPC
H01L 27/32 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 51/52 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52Details of devices
H01L 51/56 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 51/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
CPC
H01L 2227/323
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2227Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
32Devices including an organic light emitting device [OLED], e.g. OLED display
323Multistep processes for AMOLED
H01L 2227/326
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2227Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
32Devices including an organic light emitting device [OLED], e.g. OLED display
326Use of temporary substrate, e.g. for manufacturing of OLED dsiplays having an inorganic driving circuit
H01L 27/3244
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
H01L 51/003
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
003using a temporary substrate
H01L 51/0097
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0096Substrates
0097flexible substrates
H01L 51/5253
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5237Passivation; Containers; Encapsulation, e.g. against humidity
5253Protective coatings
Applicants
  • 深圳市华星光电半导体显示技术有限公司 SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. [CN]/[CN]
Inventors
  • 杨中国 YANG, Zhongguo
Agents
  • 深圳翼盛智成知识产权事务所(普通合伙) ESSEN PATENT & TRADEMARK AGENCY
Priority Data
201811605376.X26.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) FLEXIBLE OLED DISPLAY PANEL AND PREPARATION METHOD THEREOF
(FR) PANNEAU D'AFFICHAGE DELO SOUPLE ET SON PROCÉDÉ DE PRÉPARATION
(ZH) 一种柔性OLED显示面板及其制备方法
Abstract
(EN)
The present invention provides a flexible OLED display panel, which comprises a PI layer on which a light emitting area and a bending area are provided. Wherein the light emitting area comprises a first light emitting area and a second light emitting area, and the bending area is arranged between the first light emitting area and the second light emitting area. Wherein both the first light emitting area and the second light emitting area comprise a TFT layer arranged on the PI layer, and each TFT layer is provided with an OLED device layer and a thin film encapsulation layer arranged thereon, and the bending area comprises a bending layer arranged on the PI layer. Wherein the bending area is only provided with the bending layer for bending, and no water blocking layer in the thin film encapsulation layer is provided, so that there is no crack defect of the water blocking layer arranged in the bending area due to multiple bending of the bending area itself.
(FR)
La présente invention concerne un panneau d'affichage DELO souple qui comprend une couche PI sur laquelle sont disposées une zone électroluminescente et une zone de courbure. La zone électroluminescente comprend une première zone électroluminescente et une seconde zone électroluminescente, et la zone de courbure est agencée entre la première zone électroluminescente et la seconde zone électroluminescente. La première zone électroluminescente et la seconde zone électroluminescente comprennent une couche TFT disposée sur la couche de PI, et chaque couche TFT est pourvue d'une couche de dispositif DELO et d'une couche d'encapsulation de film mince disposée sur elle, et la zone de courbure comprend une couche de courbure agencée sur la couche PI. La zone de courbure n'est pourvue que de la couche de courbure pour se courber, et aucune couche de blocage d'eau dans la couche d'encapsulation de film mince n'est fournie, de telle sorte qu'il n'y a pas de défaut de fissure de la couche de blocage d'eau agencée dans la zone de courbure en raison de multiples flexions de la zone de courbure elle-même.
(ZH)
本发明提供了一种柔性OLED显示面板,包括PI层,所述PI层上设置有发光区和弯折区。其中所述发光区包括第一发光区和第二发光区,所述弯折区设置在所述第一发光区和第二发光区之间。其中所述第一发光区、第二发光区均包括设置在所述PI层上的TFT层,每一TFT层上设置有OLED器件层和其上设置的薄膜封装层,而所述弯折区包括设置在所述PI层上的弯折层。其中所述弯折区只设置用于弯折的弯折层,而不设置所述薄膜封装层中的阻水层,从而也就不存在因其自身的多次弯折而导致其内设置的所述阻水层出现裂缝瑕疵的问题。
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