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1. WO2020133732 - PACKAGING METHOD AND PACKAGING STRUCTURE

Publication Number WO/2020/133732
Publication Date 02.07.2020
International Application No. PCT/CN2019/078541
International Filing Date 18.03.2019
IPC
B81C 1/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
B81B 7/02 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems
02containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems (MEMS)
CPC
B81B 7/00
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
B81B 7/0032
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
0032Packages or encapsulation
B81B 7/007
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
0032Packages or encapsulation
007Interconnections between the MEMS and external electrical signals
B81B 7/02
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems; ; Auxiliary parts of microstructural devices or systems
02containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
B81C 1/00
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
B81C 1/00238
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00222Integrating an electronic processing unit with a micromechanical structure
00238Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
Applicants
  • 中芯集成电路(宁波)有限公司 NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION [CN]/[CN]
Inventors
  • 杨天伦 YANG, Tianlun
Agents
  • 上海思微知识产权代理事务所(普通合伙) SHANGHAI SAVVY INTELLECTUAL PROPERTY AGENCY
Priority Data
201811595035.925.12.2018CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) PACKAGING METHOD AND PACKAGING STRUCTURE
(FR) PROCÉDÉ ET STRUCTURE DE BOÎTIER
(ZH) 封装方法及封装结构
Abstract
(EN)
Provided in the present invention are a packaging method and a packaging structure. In the packaging method, firstly, a groove is formed in a cap wafer, a sacrificial layer is formed in the groove, then a first device is manufactured on the sacrificial layer, the surface, provided with the first device, of the cap wafer is bonded to a substrate wafer by adopting an inverted mode so as to achieve sealing of the first device on the cap wafer and the electrical connection between the first device and a second device on the substrate wafer, and then the sacrificial layer is removed to form a cavity required for movement of the first device. According to the technical solution of the present invention, an existing three-wafer packaging structure can be completed by using two wafers so that the cost can be reduced, the product integration level can be increased, and technical difficulties can be reduced.
(FR)
La présente invention concerne un procédé et une structure de boîtier. Selon le procédé de boîtier, tout d'abord, une rainure est formée dans une tranche de capuchon, une couche sacrificielle est formée dans la rainure, puis un premier dispositif est fabriqué sur la couche sacrificielle, la surface, pourvue du premier dispositif, de la tranche de capuchon est liée à une tranche de substrat par adoption d'un mode inversé de façon à obtenir une étanchéité du premier dispositif sur la tranche de capuchon et la connexion électrique entre le premier dispositif et un second dispositif sur la tranche de substrat, puis la couche sacrificielle est éliminée pour former une cavité nécessaire pour le mouvement du premier dispositif. Selon la solution technique de la présente invention, une structure de boîtier à trois tranches existante peut être achevée par utilisation de deux tranches de telle sorte que le coût peut être réduit, le niveau d'intégration de produit peut être augmenté, et des difficultés techniques peuvent être réduites.
(ZH)
本发明提供一种封装方法及封装结构,所述封装方法中,首先在盖帽晶圆中形成凹槽,所述凹槽中形成有牺牲层,然后在所述牺牲层上制作第一器件,并采用倒装的方式将所述盖帽晶圆形成有第一器件的表面键合到衬底晶圆上,以实现所述盖帽晶圆上的第一器件的密封及其和衬底晶圆上的第二器件的电学连接,之后除去牺牲层以形成所述第一器件活动所需的空腔。本发明的技术方案使用两片晶圆可以完成现有的三片晶圆封装结构,能够降低成本,提高产品集成度,并降低工艺难度。
Latest bibliographic data on file with the International Bureau